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Suppression of discontinuous precipitation in age-hardening Cu-15Ni-8Sn alloy by addition of V 期刊论文
Journal of Alloys and Compounds, 2020, 卷号: 813
作者:  Guo, Zhongkai;  Jie, Jinchuan;  Liu, Shichao;  Liu, Jiaming;  Yue, Shipeng
收藏  |  浏览/下载：61/0  |  提交时间：2019/12/02
Solvothermal syntheses, characterizations and semiconducting properties of four quaternary thioargentates Ba2AgInS4, Ba3Ag2Sn2S8, BaAg2MS4 (M = Sn, Ge) 期刊论文
Journal of Alloys and Compounds, 2020, 卷号: 815
作者:  Liu, Yan;  Li, Yanhua;  Zhao, Jie;  Zhang, Renchun;  Ji, Min
收藏  |  浏览/下载：58/0  |  提交时间：2019/12/02
Enhancing Propane Aromatization Performance of Zn/H-ZSM-5 Zeolite Catalyst with Pt Promotion: Effect of the Third Metal Additive-Sn 期刊论文
CATALYSIS LETTERS, 2019, 卷号: 149, 页码: 2064-2077
作者:  Zhou, Wei;  Liu, Jiaxu;  Wang, Jilei;  Lin, Long;  Zhang, Xiaotong
收藏  |  浏览/下载：30/0  |  提交时间：2019/12/02
The synthesis of hierarchical Sn-Beta zeolite via aerosol-assisted hydrothermal method combined with a mild base treatment 期刊论文
MICROPOROUS AND MESOPOROUS MATERIALS, 2019, 卷号: 287, 页码: 85-92
作者:  Meng, Qingrun;  Liu, Jiaxu;  Xiong, Guang;  Li, Xinyao;  Liu, Liping
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/02
Formation of Fe-Sn intermetallic layer and its effect on the corrosion of 304 stainless steel in high temperature water 期刊论文
INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE, 2019, 卷号: 14, 页码: 3217-3228
作者:  Guan, Jian-jun;  Zhong, Hong-yuan;  Feng, Li;  Zhao, Yan;  Liu, Feng
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/02
Evolution of atomic structures of Sn-N, and Sn-N(-), and SnNCl- clusters (N=4-20): Insight from ab initio calculations 期刊论文
JOURNAL OF CHEMICAL PHYSICS, 2019, 卷号: 150, 页码: 174304
作者:  Wu, Di;  Du, Qiuying;  Wu, Xue;  Shi, Ruili;  Sai, Linwei
收藏  |  浏览/下载：34/0  |  提交时间：2019/12/02
Effect of Sn addition on morphology evolution of secondary phase in hypomonotectic Cu-Pb-Sn alloy during solidification 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2019, 卷号: 791, 页码: 936-946
作者:  Dong, B. W.;  Jie, J. C.;  Yao, X. X.;  Liu, S. C.;  Chen, Y. H.
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
Effect of V addition on microstructures and mechanical properties of Cu-15Ni-8Sn alloy 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2019, 卷号: 748, 页码: 85-94
作者:  Guo, Zhongkai;  Jie, Jinchuan;  Liu, Shichao;  Zhang, Yubo;  Qin, Bailiang
收藏  |  浏览/下载：137/0  |  提交时间：2019/12/02
Size effect on interface reaction of Sn-xCu/Cu solder joints during multiple reflows 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 4359-4369
作者:  Huang, Ru;  Ma, Haoran;  Shang, Shengyan;  Kunwar, Anil;  Wang, Yunpeng
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02
Growth behavior of preferentially scalloped intermetallic compounds at extremely thin peripheral Sn/Cu interface 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 页码: 2872-2887
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Qu, Lin;  Ma, Haitao
收藏  |  浏览/下载：26/0  |  提交时间：2019/12/02

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