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Nano-Patterns of Photoresist Fabricated by Ultraviolet Lithography Technology 期刊论文
Journal of nanoscience and nanotechnology, 2020, 卷号: 20, 页码: 2508-2513
作者:  Cheng E;  Tang Suzhou;  Li Chen;  Zou Helin
收藏  |  浏览/下载：67/0  |  提交时间：2019/12/02
Covalent Anchoring of Carbon Nanotube-Based Thermal Interface Materials Using Epoxy-Silane Monolayers 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2019, 卷号: 9, 页码: 427-433
作者:  Nylander, Andreas;  Fu, Yifeng;  Huang, Mingliang;  Liu, Johan
收藏  |  浏览/下载：42/0  |  提交时间：2019/12/02
A study on the oxygen plasma treatment on the peel adhesion strength and solder wettability of SnBi58 based anisotropic conductive films 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Zhang, Shuye;  Huang, Mingliang;  Wu, Yang;  Yang, Ming;  Lin, Tiesong
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02
Electromigration-induced -Sn grain rotation in lead-free flip chip solder bumps 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Huang, Mingliang L.;  Kuang, Jiameng M.;  Sun, Hongyu Y.
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Effects of electromigration on microstructural evolution and mechanical properties of preferential growth intermetallic compound interconnects for 3D packaging 会议论文
69th IEEE Electronic Components and Technology Conference, ECTC 2019, Las Vegas, NV, United states, 2019-05-28
作者:  Huang, Mingliang L.;  Zou, Lin
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
Stability of Multilayered Ag/Ag3Sn/Sn Films Noncyanide Electroplateded for high-reflective back-electrode 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Ji, Shengnan;  Ma, Haitao;  Wang, Chen;  Zhao, Ning;  Wang, Yunpeng
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Growth mechanism of Cu3Sn grains in the (111) Cu/Sn/Cu micro interconnects 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Zhong, Yi;  Zhao, Ning;  Dong, Wei;  Wang, Yunpeng;  Ma, Haitao
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02
Electromigration behavior and mechanical properties of the whole preferred orientation intermetallic compound interconnects for 3D packaging 会议论文
The 68th Electronic Components and Technology Conference
作者:  Huang ML(黄明亮);  Zou L(邹林);  Yin SQ(尹斯奇)
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02
The analysis about the application of nanomaterials in food packaging 会议论文
2018 International Conference on Advanced Electronic Materials, Computers and Materials Engineering, AEMCME 2018, Singapore, Singapore, 2018-09-14
作者:  Lizhao, Huang
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02

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