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科研机构
兰州理工大学 [8]
内容类型
期刊论文 [8]
发表日期
2022 [1]
2020 [2]
2019 [3]
2018 [1]
2015 [1]
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专题:兰州理工大学
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Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP
期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:
Yu, Weiyuan
;
Li, Binbin
;
Wu, Baolei
;
Wang, Fengfeng
;
Wang, Mingkang
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2022/08/09
Binary alloys
Copper
Copper alloys
Indium alloys
Lead-free solders
Microstructure
Shear flow
Silicon carbide
Soldering
Temperature
Thermoelectric equipment
Wide band gap semiconductors
Composite solders
Electronics devices
In-45cu composite solder paste
Intermetallics compounds
Microstructures and mechanical properties
Service temperature
Shears strength
Solderpaste
Ultrasonic action time
Ultrasonic-assisted TLP
Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder
期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 12, 页码: 4297-4302
作者:
Yu, Weiyuan
;
Sun, Jungang
;
Liu, Yun
;
B., Wu
;
Z., Lei
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2022/02/17
Binary alloys
Brazing
Brazing filler metals
Grain size and shape
Intermetallics
Melting point
Microstructure
Nanoparticles
Synthesis (chemical)
Brazing joints
Composite solders
Crystal planes
Driving forces
Interfacial intermetallics
Liquidus temperature
Melting process
Melting properties
Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs
期刊论文
Vacuum, 2020, 卷号: 180
作者:
Qiu, Hongyu
;
Hu, Xiaowu
;
Li, Shuang
;
Wan, Yongqiang
;
Li, Qinglin
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/11/14
Binary alloys
Copper alloys
Elastic moduli
Fracture
Fracture mechanics
Shear flow
Soldered joints
Surface analysis
Tin alloys
Area ratios
Fracture mechanisms
Fracture surface analysis
Fracture surfaces
Fractured surfaces
Isothermal aging
Lead-free solder joint
Solder joints
Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering
期刊论文
Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602
作者:
Yu, Weiyuan
;
Liu, Yingzong
;
Liu, Yun
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2022/02/17
Binary alloys
Copper compounds
Interface states
Intermetallics
Lead-free solders
Microstructure
Phase interfaces
Soldering
Tin compounds
Ultrasonic effects
Unmanned aerial vehicles (UAV)
Formation and evolutions
Growth patterns
IMC layer
Interfacial intermetallics
Liquid interface
Nonequilibrium state
Ultrasonic vibration
Insights on interfacial IMCs growth and mechanical strength of asymmetrical Cu/SAC305/Cu-Co system
期刊论文
VACUUM, 2019, 卷号: 167, 页码: 77-89
作者:
Hu, Xiaowu
;
Li, Chao
;
Li, Qinglin
;
Yi, Guangbin
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/11/15
SAC305 lead-free solders
Interfacial reaction
Intermetallic compound
Shear strength
Fracture
Effect of flux doped with Cu6Sn5 nanoparticles on the interfacial reaction of lead-free solder joints
期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 12, 页码: 11552-11562
作者:
Wang, Haozhong
;
Hu, Xiaowu
;
Li, Qinglin
;
Qu, Min
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/11/15
Binary alloys
Coarsening
Copper
Growth rate
Morphology
Nanoparticles
Rate constants
Soldered joints
Tin alloys
Aging time
Cu substrate
IMC layer
Inhibition effect
Isothermal aging
Lead-free solder joint
Nanoparticle (NPs)
Solder joints
High Frequency Induction Brazing Process of Copper-Steel and Its Effects on Microstructure and Electrical Conductivity of Weld Joint
期刊论文
Cailiao Daobao/Materials Review, 2018, 卷号: 32, 期号: 3, 页码: 909-914
作者:
Shi, Yu
;
Gao, Haiming
;
Li, Guang
;
Li, Xiang
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2020/11/14
Binary alloys
Brazing
Diffusion
Dissimilar metals
Electric conductivity
Induction heating
Lead-free solders
Microstructure
Morphology
Plate metal
Steel
Structure (composition)
Tin alloys
Tin oxides
Welding
Welds
316 stainless steel
Connection strength
Copper steel
Diffusion reaction layer
Dissimilar metal welding
Electrical conductivity
High frequency induction brazing
Welding temperatures
Wetting behavior in ultrasonic vibration-assisted brazing of aluminum to graphite using Sn-Ag-Ti active solder
期刊论文
Surface Review and Letters, 2015, 卷号: 22, 期号: 3
作者:
Yu, Wei-Yuan
;
Liu, Sen-Hui
;
Liu, Xin-Ya
;
Shao, Jia-Lin
;
Liu, Min-Pen
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/11/14
Aluminum
Atmospheric temperature
Brazing
Graphite
Lead-free solders
Liquids
Oxides
Silver alloys
Silver oxides
Ternary alloys
Tin alloys
Titanium alloys
Titanium dioxide
Ultrasonic effects
Ultrasonic waves
Active brazing
Ambient conditions
Atmospheric conditions
Brazing temperature
Decomposition temperature
Pure aluminum
Ultrasonic vibration
Wetting and spreading
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