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浏览/检索结果: 共9条，第1-9条 帮助 限定条件 专题：兰州理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Improved Analytical Modeling of a Novel Ironless Linear Synchronous Machine With Asymmetrical Double-Layer Winding Topology 期刊论文 IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, 2021, 卷号: 57, 期号: 2, 页码: 1411-1419 作者:  Xie, Zhedong;  Lu, Qinfen;  Mei, Weihu;  Li, Yanxin 收藏  |  浏览/下载：26/0  |  提交时间：2021/06/03 Windings  Analytical models  Permanent magnet motors  Harmonic analysis  Air gaps  Semiconductor process modeling  Reluctance motors  Analytical model  asymmetry  double-layer windings  ironless permanent magnet linear synchronous motor (ILPMLSM)  longitudinal end effect   Modeling of evolution process of edge over erosion in copper CMP using frequency components algorithm 会议论文 Shanghai, China, March 13, 2016 - March 14, 2016 作者:  Wu, Lixiao;  Hahn, Sookap;  Yan, Changfeng 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/15 Copper  Linear systems  Polishing  Semiconductor device manufacture  Silicon wafers  Textile printing  Copper CMP  Evolution process  Frequency components  Pattern density  Pattern structure  Polishing processs  Square waves  Wafer patterns   MODELING OF EVOLUTION PROCESS OF EDGE OVER EROSION IN COPPER CMP USING FREQUENCY COMPONENTS ALGORITHM 会议论文 作者:  Wu, Lixiao;  Hahn, Sookap;  Yan, Changfeng 收藏  |  浏览/下载：5/0  |  提交时间：2019/11/15 Effects of Polishing Parameters on Evolution of Different Wafer Patterns During Cu CMP 期刊论文 IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2015, 卷号: 28, 期号: 1, 页码: 106-116 作者:  Wu, Lixiao;  Yan, Changfeng 收藏  |  浏览/下载：10/0  |  提交时间：2019/11/15 Polishing parameters  wafer patterns  chemical mechanical polishing (CMP)  linear system  contact pressure   Effects of polishing parameters on evolution of different wafer patterns during Cu CMP 期刊论文 IEEE Transactions on Semiconductor Manufacturing, 2015, 卷号: 28, 期号: 1, 页码: 106-116 作者:  Wu, Lixiao;  Yan, Changfeng 收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14 Copper  Elastic moduli  Erosion  Linear systems  Polishing  Topography  Chemical mechanical polishing(CMP)  Contact pressures  High selectivity  Polishing parameters  Polishing processs  Preston coefficients  Selectivity ratio  Wafer patterns   3-D Modeling of Wafer Topography's Effect on Chemical Mechanical Polishing Process 会议论文 作者:  Wu, Lixiao;  Yan, Changfeng 收藏  |  浏览/下载：6/0  |  提交时间：2019/11/15 3-D modeling of wafer topography's effect on chemical mechanical polishing process 会议论文 Vienna, Austria, October 4, 2009 - October 9, 2009 作者:  Wu, Lixiao;  Yan, Changfeng 收藏  |  浏览/下载：3/0  |  提交时间：2020/11/15 Chemical mechanical polishing  Polishing  Semiconductor materials  Silicon wafers  Chemical-mechanical polishing process  Complicated topographies  Contact pressures  Linear combinations  Magnitude spectrum  Polishing parameters  Solid-solid contacts  Wafer topography   Modeling of wafer topography's chemical-mechanical polishing effect on process 期刊论文 IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2007, 卷号: 20, 期号: 4, 页码: 439-450 作者:  Wu, Lixiao 收藏  |  浏览/下载：7/0  |  提交时间：2019/11/15 chemical-mechanical polishing (CMP)  contact mechanics  finite-element method (FEM)  Fourier transform  wafer surface topography   Modeling of wafer topography's effect on chemical-mechanical polishing process 期刊论文 IEEE Transactions on Semiconductor Manufacturing, 2007, 卷号: 20, 期号: 4, 页码: 439-450 作者:  Wu, Lixiao 收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14 Polishing  Topography  Chemical mechanical polishing(CMP)  Chemical-mechanical polishing process  Complex topographies  High frequency components  Linear time-invariant system  Low-frequency components  Magnitude spectrum  Wafer topography