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科研机构
兰州理工大学 [4]
内容类型
期刊论文 [4]
发表日期
2018 [2]
2011 [2]
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Fatigue Crack Propagation Mechanism of gamma-TiAl Alloy under Different Strain Ratios
期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2018, 卷号: 47, 期号: 9, 页码: 2821-2826
作者:
Feng Ruicheng(冯瑞成)
;
Lu Jiantao
;
Li Haiyan(李海燕)
;
Cao Hui(曹卉)
;
Yan Feng
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/11/15
strain ratio
fatigue crack propagation
gamma-TiAl alloy
stacking fault
molecular dynamics
Fatigue Crack Propagation Mechanism of γ-TiAl Alloy under Different Strain Ratios
期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2018, 卷号: 47, 期号: 9, 页码: 2821-2826
作者:
Feng, Ruicheng
;
Lu, Jiantao
;
Li, Haiyan
;
Cao, Hui
;
Yan, Feng
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2020/11/14
Fatigue crack propagation
Fatigue of materials
Molecular dynamics
Stacking faults
Titanium alloys
Close-packed planes
Different planes
Disordered regions
Driving forces
Gamma tial alloys
Molecular dynamics methods
Strain ratios
TiAl alloy
Effect of microstructure and temperature on oxidation behavior of pure copper
期刊论文
Cailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment, 2011, 卷号: 32, 期号: 12, 页码: 147-150
作者:
Cao, Jun
;
Ding, Yu-Tian
;
Lu, Zhen-Hua
;
Hu, Yong
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2020/11/14
Atoms
Copper
Crystal atomic structure
Equal channel angular pressing
Grain boundaries
Grain size and shape
Pressing (forming)
X ray diffraction
Atomic packing
Close-packed planes
Copper oxidation
Copper surface
Crystal planes
Different structure
Diffusion rate
ECAP
Grain size
Internal energies
Low energies
Oxidation behaviors
Oxidation film
Oxidation rate
Oxidation rates
Oxygen atom
Polycrystalline copper
Pure copper
Temperature increase
Weight gain
Effect of microstructure and temperature on oxidation behavior of pure copper
期刊论文
Cailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment, 2011, 卷号: 32, 期号: 12, 页码: 147-150
作者:
Cao, Jun
;
Ding, Yu-Tian
;
Lu, Zhen-Hua
;
Hu, Yong
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2022/02/17
Atoms
Copper
Crystal atomic structure
Equal channel angular pressing
Grain boundaries
Grain size and shape
Pressing (forming)
X ray diffraction
Atomic packing
Close-packed planes
Copper oxidation
Copper surface
Crystal planes
Different structure
Diffusion rate
ECAP
Grain size
Internal energies
Low energies
Oxidation behaviors
Oxidation film
Oxidation rate
Oxidation rates
Oxygen atom
Polycrystalline copper
Pure copper
Temperature increase
Weight gain
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