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CORC

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Influence of Viscoelastic Underfill on Thermal Mechanical Reliability of a 3-D-TSV Stack by Simulation 期刊论文
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2017
Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Thermal Conductivity of Graphene-Polymer Composites: Mechanisms, Properties, and Applications 期刊论文
POLYMERS, 2017
Li, An; Zhang, Cong; Zhang, Yang-Fei
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03
New Understanding of Random Telegraph Noise Amplitude in Tunnel FETs 期刊论文
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2017
Chen, Cheng; Huang, Qianqian; Zhu, Jiadi; Zhao, Yang; Guo, Lingyi; Huang, Ru
收藏  |  浏览/下载：9/0  |  提交时间：2017/12/03
Fabrication and Comparison of Bumpless Wafer-on-Wafer Integration and Bump-Containing Chip-on-Chip Integration 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017
Guan, Yong; Zhu, Yunhui; Ma, Shenglin; Zeng, Qinghua; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
赛道存储器移动操作的温度模型及控制策略 期刊论文
计算机研究与发展, 2017
张超; 孙广宇; 张学莹; 赵巍胜
收藏  |  浏览/下载：8/0  |  提交时间：2017/12/03
Dominant parameters affecting the reliability of TBCs on a gas turbine blade during erosion by a particle-laden hot gas stream 期刊论文
WEAR, 2017
Xiao, Y. Q.; Yang, L.; Zhou, Y. C.; Wei, Y. G.; Wang, N. G.
收藏  |  浏览/下载：11/0  |  提交时间：2017/12/03
Novel Vertical 3D Structure of TaOx-based RRAM with Self-localized Switching Region by Sidewall Electrode Oxidation 期刊论文
SCIENTIFIC REPORTS, 2016
Yu, Muxi; Cai, Yimao; Wang, Zongwei; Fang, Yichen; Liu, Yefan; Yu, Zhizhen; Pan, Yue; Zhang, Zhenxing; Tan, Jing; Yang, Xue; Li, Ming; Huang, Ru
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
Encapsulation layer design and scalability in encapsulated vertical 3D RRAM 期刊论文
NANOTECHNOLOGY, 2016
Yu, Muxi; Fang, Yichen; Wang, Zongwei; Chen, Gong; Pan, Yue; Yang, Xue; Yin, Minghui; Yang, Yuchao; Li, Ming; Cai, Yimao; Huang, Ru
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill 其他
2016-01-01
Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Bimaterial Cantilever Focal Plane Array for Uncooled Infrared Imaging Using Sandwich-Framed Structure 期刊论文
JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2016
Ma, Wei; Zhao, Rui; Wang, Shuyang; Yu, Xiaomei; Feng, Yun; Zhao, Yuejing
收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03

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