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Simulation and evaluation of thermal mechanical reliability of 3D-TSV stack with viscoelastic underfill 其他
2016-01-01
Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载:6/0  |  提交时间:2017/12/03
Simulation and Evaluation of Thermal Mechanical Reliability of 3D-TSV Stack with Viscoelastic Underfill 其他
2015-01-01
Zeng, Qinghua; Guan, Yong; Su, Fei; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载:4/0  |  提交时间:2017/12/03
Novel multicontact radio frequency microelectromechanical system switch in high-power-handling applications 其他
2011-01-01
Liu, Bo; Lv, Zhiqiu; He, Xunjun; Hao, Yilong; Li, Zhihong
收藏  |  浏览/下载:5/0  |  提交时间:2017/12/03
A MIM diode with ultra abrupt switching process and high on/off current ratio 其他
2011-01-01
Zhang, Lijie; Huang, Ru
收藏  |  浏览/下载:5/0  |  提交时间:2015/11/13
萃取分离ICP-AES法测定高纯金中的杂质元素 其他
2001-01-01
孙丹丹; 曹昕宇
收藏  |  浏览/下载:3/0  |  提交时间:2015/10/24


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