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	Simulation and Evaluation of Thermal Mechanical Reliability of 3D-TSV Stack with Viscoelastic Underfill
	Zeng, Qinghua ; Guan, Yong ; Su, Fei ; Chen, Jing ; Jin, Yufeng
	2015
英文摘要	This paper studies how the underfill with viscoelastic properties impacts the thermal mechanical reliability of a 3D-TSV package system. The Williams-Landel-Ferry equation and the relaxation modulus function in Prony series are used to characterize the viscoelasticity that is both temperature dependent and time-dependent. The finite element model subjected to a thermal cycle consists of a four-layer chip stack, silicon interposer, solder balls and PCB board. Silicon chips with TSVs are vertically stacked by micro-bumps of Cu-Sn. It is revealed that the chip deformation is increased while the reliability of the micro-bumps are decreased. For applications undergoing heavy thermal cycles, it is not suggested to include underfill in the 3D-TSV stack. The necessity of definition of viscoelasticity properties rather than simplified elasticity is also affirmed by comparison.; CPCI-S(ISTP); j.chen@pku.edu.cn
语种	英语
出处	17th IEEE Electronics Packaging and Technology Conference (EPTC)
内容类型	其他
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/450363]
专题	信息科学技术学院
推荐引用方式 GB/T 7714	Zeng, Qinghua,Guan, Yong,Su, Fei,et al. Simulation and Evaluation of Thermal Mechanical Reliability of 3D-TSV Stack with Viscoelastic Underfill. 2015-01-01.

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