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Simulation and experimental investigation on linear expansion micro-stress assembly process of adhesive bonded mirror 会议论文
Kunming, China, 2021-12-07
作者:  Zheng, Xiang-Ke;  Kang, Shi-Fa;  Wang, Peng;  Li, Hua;  Shu, Lin-Sen
收藏  |  浏览/下载：27/0  |  提交时间：2022/04/27
Study on assembly technology of primary and secondary mirror system based on truss structure 会议论文
Chengdu, China, 2021-06-14
作者:  Peng, Wang;  Xing, Song;  Xiao-Hua, Hou;  Zhong, Shen
收藏  |  浏览/下载：14/0  |  提交时间：2022/03/10
Direct-Bonding TC4 and PA Plastics by a Nanosecond Laser Lap Joining Technology 会议论文
2018 Conference on Lasers and Electro-Optics Pacific Rim, CLEO-PR 2018, 2018-07-29
作者:  Zhihao, F.;  Longfei, C.;  Yingchun, G.
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/30
Controllable Micro/nano-fluidic Channel Bonding Process Based on the Expansion Centerline and “Filling-Barrier” Structure 会议论文
杭州, 2018
作者:  Yu Hua;  Jiadong Qi;  Jian Jin;  Si Di
收藏  |  浏览/下载：9/0  |  提交时间：2019/01/31
Study of the residual stresses variation into the sandwich structure subjected to thermomechanical loading 会议论文
Xi’an, China, May 30, 2018 - May 31, 2018
作者:  Messaoudi, Khalid;  Bouafia, Farida;  Benkhenafou, Fethi;  Douadji, Lyes;  Du, Wei Wei
收藏  |  浏览/下载：26/0  |  提交时间：2019/06/25
Identification of bonding strength for explosive clad pipe utilizing vibration characteristics 会议论文
作者:  Cao, Jianbin;  Zhang, Zhousuo
收藏  |  浏览/下载：4/0  |  提交时间：2019/11/19
Research on remelting phenomena and metal joining of fused-coating additive manufacturing 会议论文
作者:  Wang, X.;  Du, J.;  Wei, Z.Y.;  Zhao, G.X.;  Ren, C.Q.
收藏  |  浏览/下载：11/0  |  提交时间：2019/11/19
Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
High power vertical stacked and horizontal arrayed diode laser bar development based on insulation micro-channel cooling (IMCC) and hard solder bonding technology 会议论文
San Francisco, CA, United states, 2018-01-30
作者:  Wang, Boxue;  Jia, Yangtao;  Zhang, Haoyu;  Jia, Shiyin;  Liu, Jindou
收藏  |  浏览/下载：71/0  |  提交时间：2018/04/25

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