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The Research of Qualification Detection of Cable Joint Solder Joint Based on DCNN 会议论文
Dublin, Ireland, October 17, 2019 - October 19, 2019
作者:  Ma, Donglin;  Lei, Xiaoqiang;  Zhao, Hong
收藏  |  浏览/下载：10/0  |  提交时间：2020/11/15
Effect of soldering temperature on cross-interaction at L-S interface of linear Cu/SAC305/Ni solder joints 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Guo, Bingfeng;  Huang, Ru;  Yao, Jinye;  Qi, Xiao;  Kunwar, Anil
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/02
Effect of Temperature Gradient on Interfacial Reactions in Cu/Sn-9Zn/Ni Solder Joints during Aging 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhao, Ning;  Wang, Mingyao;  Zhong, Yi;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：19/0  |  提交时间：2019/12/02
Influence of Cu nanoparticles on Cu6Sn5 growth behavior at the interface of Sn/Cu solder joints 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Shang, Shengyan;  Kunwar, Anil;  Wang, Yanfeng;  Yao, Jinye;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Diffusion barrier properties of electroless Ni-Fe-P coatings in Zn-5Al solder joints 会议论文
作者:  Zhang, Han;  Chen, Zhiwen;  Pengv, Juan;  Liu, Li
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/05
Plastic deformation behavior of IMCs in solder joints during nanoindentation 会议论文
作者:  Yang, Fan;  Liu, Sheng;  Liu, Li;  Chen, Zhiwen
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/05
Research on Probabilistic Failure Physical Model of BGA Solder Joints in Multiple Fields Coupling 会议论文
2018 PROGNOSTICS AND SYSTEM HEALTH MANAGEMENT CONFERENCE (PHM-CHONGQING 2018), 2018-01-01
作者:  Li, Sufen;  Sun, Yufeng;  Li, Xiaoxiao
收藏  |  浏览/下载：15/0  |  提交时间：2019/12/30
Effect of Ag concentration on the Cu6Sn5 growth in Sn-based solder/Cu joints at the isothermal reflow stage 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Guo, Bingfeng;  Jiang, Chengrong;  Kunwar, Anil;  Zhao, Ning;  Chen, Jun
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Study on interfacial reactions in Cu/Sn-9Zn/Ni micro solder joints under temperature gradient 会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:  Zhao, Ning;  Wang, Mingyao;  Zhong, Yi;  Ma, Haitao;  Wang, Yunpeng
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/03
A Fatigue Life Model of BGA Solder Joints based on Energy 会议论文
PROCEEDINGS OF THE 2ND INTERNATIONAL CONFERENCE ON RELIABILITY SYSTEMS ENGINEERING (ICRSE 2017), 2017-01-01
作者:  Liu, Jiamin;  Hu, Weiwei;  Chen, Hao;  Wang, Jiuxing
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30

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