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| Effects of Laser Welding Parameters on the Characteristics of Deposition Layer 会议论文 作者: Su, Guoxing; Shi, Yu; Zhang, Gang; Xie, Jinlong 收藏  |  浏览/下载:14/0  |  提交时间:2019/11/15
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| A low-melting-point alloy filled epoxy conductive adhesives as thermal interface materials 会议论文 Harbin, China 作者: Jia-Hui Kang; Jia-Li Sheng; Xian-Zhu Fu; Rong Sun; Ching-Ping Wong 收藏  |  浏览/下载:15/0  |  提交时间:2018/02/02 |
| The Preparation of Monodisperse Silver Nanoparticles and its Application in Flexible Printed Electronics 会议论文 Harbin, China 作者: Weifang Shao; Pengli Zhu; Yougen Hu; Rong Sun; Chingping Wong 收藏  |  浏览/下载:19/0  |  提交时间:2018/02/02 |
| Thermally conductive adhesives based on silver coated copper flake fillers 会议论文 The 16th International Conference on electronic packing Technology (ICEPT 2015), Changsha,China 作者: Jin-Qi Xie; Hu-Ming Ren; Kai Zhang; Matthew M.F.Yuen; S.W.Ricky Lee 收藏  |  浏览/下载:12/0  |  提交时间:2016/01/27 |
| A study of underfill using two kinds of Silica as inorganic filler 会议论文 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China 作者: Zhang Wenjie; Zhu Pengli; Zhao Tao; Sun Rong; Wong Chingping 收藏  |  浏览/下载:6/0  |  提交时间:2015/08/27 |
| Effect of wetting agent on the properties of thermal grease with Al based fillers 会议论文 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China 作者: Zhang Ling; Zhang Zhi; Zhu Pengli; Zhang Kai; Fu Xianzhu 收藏  |  浏览/下载:4/0  |  提交时间:2015/08/27 |
| High temperature rheology property of asphalt mastic with different mineral filler 会议论文 Hangzhou, China, March 9, 2012 - March 11, 2012 作者: Li, Xiaomin; Nan, Xueli; Wei, Dingbang 收藏  |  浏览/下载:0/0  |  提交时间:2020/11/15
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| 聚烯烃复合材料的老化行为及机理 会议论文 2006年全国高分子材料科学与工程研讨会论文集, Proceedings of 2006 National Symposium of Polymer Materials Science and Engineering, 2006年全国高分子材料科学与工程研讨会, 2006 National Symposium of Polymer Materials Science and Engineering, 中国四川绵阳, CNKI, 中国化学会、中国机械工程学会、中国材料研究学会 李吉芳; 杨睿; 于建; 刘颖; Jifang Li; Rui Yang; Jian Yu; Ying Liu 收藏  |  浏览/下载:3/0 |
| 聚合物中高性能复合填料的制备与性能表征 会议论文 2008国际粉体技术与应用论坛暨全国粉体产品与设备应用技术交流大会, CNKI 杨玉芬; 盖国胜; 蔡振芳; YANG Yu-fen; GAI Guo-sheng; CAI Zheng-fang 收藏  |  浏览/下载:3/0 |
| Preparing and Study on Thermal-Conductive Epoxy Resin/M Composites 会议论文 作者: Feng, Hui-xia; Zhang, Guo-hong; Liu, Jing-chen; Luo, He-ming 收藏  |  浏览/下载:0/0  |  提交时间:2019/11/15
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