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会议论文 [43]
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Study on adhesive curing process and bonding property of XM-31 silicone rubber
会议论文
Shanghai, China, 2021-10-28
作者:
Zheng, Xiangke
;
Wang, Peng
;
Kang, Shifa
;
Duan, Zhanjun
;
Jia, Xin
收藏
  |  
浏览/下载:82/0
  |  
提交时间:2022/03/18
XM-31 adhesive
Curing process
Volume shrinkage
Mechanical properties
Adhesive performance
Design and analysis of bonding process of the space-based rectangular curved prisms
会议论文
Shanghai, China, 2021-10-28
作者:
Jia, Xinyin
;
Wang, Feicheng
;
Ke, Shanliang
;
Hu, Bingliang
;
Li, Libo
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  |  
浏览/下载:42/0
  |  
提交时间:2022/03/18
bonding process
curved prisms
mechanical tests
adhesive bonding
Study on assembly technology of primary and secondary mirror system based on truss structure
会议论文
Chengdu, China, 2021-06-14
作者:
Peng, Wang
;
Xing, Song
;
Xiao-Hua, Hou
;
Zhong, Shen
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  |  
浏览/下载:14/0
  |  
提交时间:2022/03/10
Carbon fiber truss
Adhesive assembly
Primary and secondary mirror system
Optical axis consistency
Curing shrinkage stress and deformation analysis of adhesive bonding large aperture mirror
会议论文
Chengdu, China, 2018-06-26
作者:
Sun, Li-Jun
;
Li, Li-Bo
;
Li, Si-Yuan
;
Zhao, Qiang
;
Sun, Jian
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  |  
浏览/下载:24/0
  |  
提交时间:2019/03/22
Study on the near-field non-linearity (SMILE) of high power diode laser arrays
会议论文
San Francisco, CA, United states, 2018-01-30
作者:
Zhang, Hongyou
;
Jia, Yangtao
;
Li, Changxuan
;
Zah, Chung-En
;
Liu, Xingsheng
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  |  
浏览/下载:57/0
  |  
提交时间:2018/04/25
Development of Auto Infrared Photoelastic Microscope for Stress Measurement of Silicon
会议论文
Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018
作者:
Li, T.
;
Yao, R.
;
Yu, C.
;
Su, F.
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  |  
浏览/下载:4/0
  |  
提交时间:2019/12/30
Cracks
Elasticity
Electronics packaging
Light polarization
Microscopes
Optical devices
Silicon carbide
Silicon wafers
Stresses
Wafer bonding
Wide band gap semiconductors
Electronic Packaging
Heating platform
Phase difference
Quarter wave-plate
Si-based materials
Silicon-based materials
Stress birefringence
Temperature cycling tests
Three dimensional integrated circuits
High Power Diode Laser Array Development using Completely Indium Free Packaging Technology with Narrow Spectrum
会议论文
conference on components and packaging for laser systems ii, san francisco, ca, 2016-02-16
作者:
Hou, Dong
;
Wang, Jingwei
;
Gao, Lijun
;
Liang, Xuejie
;
Li, Xiaoning
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  |  
浏览/下载:16/0
  |  
提交时间:2016/10/18
Horizontal array
Hard Solder
Spetrum Control
Development and Alignment for SiC Mirror Subsystem of a space-borne telescope
会议论文
international symposium on advanced optical design and manufacturing technologies / international symposium on astronomical telescope and instrumentation, beijing, peoples r china, 2016-05-09
作者:
Feng Liang-jie
;
Wang Wei
;
Ren Gruo-rui
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  |  
浏览/下载:25/0
  |  
提交时间:2017/03/20
Space-borne telescope
SiC mirror
bipod flexure
optical surface distortion
curing stress
A new manufacturing technology of radio telescope panel
会议论文
SPIE vol.9673, 北京, 2015-5-5
作者:
Pengzhi LI
;
Yi CHEN
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  |  
浏览/下载:33/0
  |  
提交时间:2016/01/21
radio telescope panel
mold design
foil sticking in a vacuum
metal bonding
precision compensation
stress release
High Power Diode Laser Stack Development Using Gold-Tin Bonding Technology
会议论文
conference on components and packaging for laser systems, san francisco, ca, 2015-02-09
作者:
Hou, Dong
;
Wang, Jingwei
;
Zhang, Pu
;
Cai, Lei
;
Dai, Ye
收藏
  |  
浏览/下载:17/0
  |  
提交时间:2015/12/04
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