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浏览/检索结果: 共35条，第1-10条 帮助 限定条件 内容类型：会议论文    专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effect of Gold Wire Configuration Parameters on the Reliability of the Stacked Die Package (CPCI-S收录) 会议论文 PROCEEDINGS OF 2014 10TH INTERNATIONAL CONFERENCE ON RELIABILITY, MAINTAINABILITY AND SAFETY (ICRMS), VOLS I AND II 作者:  Tang, Y.[1,2];  Zhang, P. F.[1];  Zhou, B.[3];  Li, G. Y.[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 wire bonding  wire configuration parameters  stacked die package  FEM   The application of statistic inference in the SMS package model (EI收录) 会议论文 Applied Mechanics and Materials, Zhengzhou, Henan, China, August 17, 2013 - August 18, 2013 作者:  Chen, Miao Chao[1];  Zhou, Ting[2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Mathematical models  Parameter estimation  Poisson distribution   Three-Dimensional X-Ray Laminography as a Tool for Detection and Characterization of Package on Package(PoP) Defects (CPCI-S收录) 会议论文 PROCEEDINGS OF 2014 10TH INTERNATIONAL CONFERENCE ON RELIABILITY, MAINTAINABILITY AND SAFETY (ICRMS), VOLS I AND II 作者:  Chen, Yuan[1];  Lin, Na[2];  Lai, Ping[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/12 Package on Package(PoP)  Non-destructive  X-Ray  Computed Tomography   Reliability test and failure analysis of high-brightness LEDs from Cree under the various injection currents (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Liu, W.[1];  Li, N.[1];  Lei, P.[1];  Zou, B. B.[1];  Jin, P.[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 high power LEDs  reliability  failure  electrical stress  LED package technique   Tri-band antenna in package for single-chip WLAN/60GHz radio (EI收录) 会议论文 2012 IEEE Asia-Pacific Conference on Antennas and Propagation, APCAP 2012 - Proceedings, Singapore, Singapore, August 27, 2012 - August 29, 2012 作者:  Tu, Zhihong[1,2];  Zhang, Yue Ping[2];  Chu, Qing-Xin[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Ultrasound-assisted brazing of large area Cu/Al dissimilar metals used for package heat dissipation substrate (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Xiao, Yong[1];  Li, Mingyu[1];  Kim, Jongmyung[2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/15 Cu-Al brazing  Zn-Al alloy  ultrasonic vibration  microstructure  tensile strength  corrosion resistance   Research on eutectic bonding processes and interfacial damage features in high power LED package (EI收录) 会议论文 ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, Guilin, China, August 13, 2012 - August 16, 2012 作者:  Liu, W.[1];  Jin, P.[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Electronics packaging  Light emitting diodes  Technology   Research on eutectic bonding processes and interfacial damage features in high power LED package (CPCI-S收录) 会议论文 2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012) 作者:  Liu, W.[1];  Jin, P.[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Three-dimensional X-ray laminography and application in failure analysis for System in Package (SiP) (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者:  Chen, Yuan[1];  Lin, Na[2] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Computerized tomography  Consumer products  Electronics packaging  Failure analysis  Technology  Tomography  X ray analysis  X rays   Optimal design of package structure of the hybrid integrated DC/DC power module based on orthogonal experimental method (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者:  Weng, Jiancheng[1,2];  Liu, Ganggang[3];  He, Xiaoqi[2];  Zhou, Bin[2];  En, Yunfei[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Electronics packaging  Packaging