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| Investigation the Effect of Silane onto Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文
Harbin, China
作者: Qiang Liu; Guoping Zhang; Rong Sun; S. W. Ricky Lee; Ching-Ping Wong
  收藏 | 浏览/下载：14/0 | 提交时间：2018/02/02 |
| Formation of Polymer Insulation Layer (Liner) on Through Silicon Vias (TSV) with High Aspect Ratio over 5:1 by Direct Spin Coating 会议论文
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV
作者: Li, Liyi; Tuan, Chia-Chi; Moon, Kyoung-Sik; Zhang, Guoping; Sun, Rong
收藏 | 浏览/下载：37/0 | 提交时间：2017/01/15 |
| Fabricating Photosensitive Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者: Qiang Liu; Guoping Zhang; Rong Sun; S. W. Ricky Lee; C. P. Wong
收藏 | 浏览/下载：21/0 | 提交时间：2017/01/15 |
| Preparation and characterization of TiB2 coatings with ultra-low low residual stress 会议论文
MSEE2016, 四川成都
作者: Chun-lei Jiang; Hai-Li Zhu; Kyunsoo Shin; Tao Wang; Guanghai Chen
收藏 | 浏览/下载：16/0 | 提交时间：2017/01/15 |
| Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文
IEEE Electronic Components and Technology Conference（ECTC）, 美国
作者: Guoping Zhang; Kun Jiang; Qiang Liu; Jinhui Li; Rong Sun
收藏 | 浏览/下载：15/0 | 提交时间：2016/01/27 |
| O2 plasma treatment in polymer insulation process for through silicon vias 会议论文
Proceedings of the Electronic Packaging Technology Conference, EPTC,, 中国
作者: Zhuang, Lulu; Jiang, Kun; Zhang, Guoping; Tang, Jiaoning; Sun, Rong
收藏 | 浏览/下载：20/0 | 提交时间：2015/09/01 |
| Novel spray coating process with polymer material applied in CIS wafer-level-packaging 会议论文
2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014, Singapore, Singapore
作者: Yuechen Zhuang; Daquan Yu; Fengwei Dai; Zhongcai Niu; Wenqi Zhang
收藏 | 浏览/下载：31/0 | 提交时间：2015/09/01 |
| Spray coating process with polymer material for insulation in CIS-TSV wafer-level-packaging 会议论文
2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014, Chengdu, China
作者: Yuechen Zhuang; Daquan Yu; Fengwei Dai; Guoping Zhang; Jun Fan
收藏 | 浏览/下载：33/0 | 提交时间：2015/09/01 |
| Wetting Behavior of Polymer Liquid in Insulation Process for Through Silicon Via 会议论文
2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China
作者: Zhao Songfang; Zhang Guoping; Sun Rong; Lee S. W. Ricky
收藏 | 浏览/下载：13/0 | 提交时间：2015/08/27 |
