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科研机构
大连理工大学 [49]
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会议论文 [49]
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2018 [6]
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内容类型:会议论文
专题:大连理工大学
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Oxidation Kinetics Researches under the Condition of Compressive Loading
会议论文
2018 2ND INTERNATIONAL CONFERENCE ON ADVANCED TECHNOLOGIES IN MANUFACTURING AND MATERIALS ENGINEERING (ATMME 2018), 2018-01-01
作者:
Zhou, C. H.
;
Pan, R. Y.
;
Ma, H. T.
;
Zhang, H.
;
Guan, X. G.
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/02
Identification of Vessel Kinetics Based on Neural Networks via Concurrent Learning
会议论文
ADVANCES IN NEURAL NETWORKS - ISNN 2018, 2018-01-01
作者:
Gu, Nan
;
Liu, Lu
;
Wang, Dan
;
Peng, Zhouhua
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2019/12/02
Neural networks
Concurrent learning
Kinetics identification
Autonomous surface vehicles
Hydrocarbons Synthesis from CO2 Hydrogenation over Fe-based Catalysts: Reaction Pathways and Kinetics from DFT
会议论文
255th ACS National Meeting & Exposition
作者:
Nie XW(聂小娃)
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/02
Effect of Ag content on Cu6Sn5 growth behavior at Sn-Ag/Cu solder interface during multiple reflows
会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:
Ma, Haoran
;
Yao, Jinye
;
Wang, Chen
;
Shang, Shengyan
;
Wang, Yunpeng
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/12/02
Soldering
Interface
Nanoparticles
Growth kinetics
Diffusion
Mechanism of Cu5Zn8 layer act as a diffusion barrier layer
会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:
Yao, Jinye
;
Li, Hua
;
Huang, Ru
;
Qi, Xiao
;
Wang, Boyin
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/12/02
Cu5Zn8
interfacial intermetallic compounds
lead-free solder
growth kinetics
Kinetics of waterborne fluoropolymers prepared by one-step semi-continuous emulsion polymerization of chlorotrifluoroethylene, vinyl acetate, butyl acrylate andVeova 10
会议论文
2ND INTERNATIONAL CONFERENCE ON NEW MATERIAL AND CHEMICAL INDUSTRY (NMCI2017), 2018-01-01
作者:
Liu, H. Z.
;
Wang, M. H.
;
Wang, Z. F.
;
Bian, J. M.
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/12/02
Kinetics of waterborne fluoropolymers prepared by one-step semi-continuous emulsion polymerization of chlorotrifluoroethylene, vinyl acetate, butyl acrylate and veova 10
会议论文
IOP Conf. Series: Materials Science and Engineering
作者:
Bian JM(边继明)
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  |  
浏览/下载:3/0
  |  
提交时间:2019/12/02
The effect of reflow temperature on IMC growth in Sn/Cu and Sn0.7Cu/Cu solder bumps during multiple reflows
会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:
Ma, H. R.
;
Wang, Y. P.
;
Chen, J.
;
Ma, H. T.
;
Zhao, N.
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/03
multiple reflow
interface
intermetallic compounds
growth kinetics
temperature
The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflows
会议论文
2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017-01-01
作者:
Ma, H. R.
;
Li, S.
;
Yao, M. J.
;
Wang, Y. P.
;
Chen, J.
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/03
cooling rate
interface
intermetallic compounds
growth kinetics
SEM
Synchrotron Radiation
The effect of cooling rate on growth kinetics of interfacial IMCs during multiple reflows
会议论文
18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, China, 2017-08-16
作者:
Ma, H.R.
;
Li, S.
;
Yao, M.J.
;
Wang, Y.P.
;
Chen, J.
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/12/03
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