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CORC

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Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD
收藏  |  浏览/下载：20/0  |  提交时间：2018/06/05
In-situ TEM mechanical characterization of nanowire in atomic scale using MEMS device 期刊论文
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2018, 卷号: 24, 期号: 4, 页码: 2045, 2049
作者:  Zhang, Xiao;  Yang, Yang;  Xu, Fangfang;  Li, Tie;  Wang, Yuelin
收藏  |  浏览/下载：27/0  |  提交时间：2018/12/28
Dynamic interfacial mechanical-thermal characteristics of atomically thin two-dimensional crystals 期刊论文
NANOSCALE, 2018, 卷号: 10, 期号: 28, 页码: 13548, 13554
作者:  Xu, Kunqi;  Ye, Shili;  Lei, Le;  Meng, Lan;  Hussain, Sabir
收藏  |  浏览/下载：32/0  |  提交时间：2018/12/28
Transport properties of MnTe films with cracks produced in thermal cycling process 期刊论文
SPRINGER, 2017, 卷号: 123, 期号: 10, 页码: -
作者:  Yang, Liang;  Wang, Zhenhua;  Zhang, Zhidong;  Wang, ZH (reprint author), Univ Chinese Acad Sci, Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, 72 Wenhua Rd, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：14/0  |  提交时间：2018/01/10
Sealing-free fast-response paraffin/nanoporous gold hybrid actuator 期刊论文
IOP PUBLISHING LTD, 2017, 卷号: 28, 期号: 38, 页码: -
作者:  Ye, Xing-Long;  Jin, Hai-Jun;  Ye, XL;  Jin, HJ (reprint author), Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：13/0  |  提交时间：2018/01/10
Failure Mechanisms of SAC/Fe-Ni Solder Joints During Thermal Cycling 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2017, 卷号: 46, 期号: 8, 页码: 5338-5348
Gao, Li-Yin; Liu, Zhi-Quan; Li, Cai-Fu
收藏  |  浏览/下载：34/0  |  提交时间：2017/08/17

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