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Achieving higher thermoelectric performance of n-type PbTe by adjusting the band structure and enhanced phonon scattering 期刊论文
NANOSCALE, 2022
作者:  Wu, Wei;  Zhu, Chen;  Ming, Hongwei;  Chen, Tao;  Li, Di
收藏  |  浏览/下载：16/0  |  提交时间：2022/12/23
High Thermoelectric Performance of Cu3SbSe4 Obtained by Synergistic Modulation of Power Factor and Thermal Conductivity 期刊论文
ACS APPLIED ENERGY MATERIALS, 2022
作者:  Ai, Li;  Ming, Hongwei;  Chen, Tao;  Chen, Ke;  Zhang, Jinhua
收藏  |  浏览/下载：16/0  |  提交时间：2022/12/22
Improved Solubility in Metavalently Bonded Solid Leads to Band Alignment, Ultralow Thermal Conductivity, and High Thermoelectric Performance in SnTe 期刊论文
ADVANCED FUNCTIONAL MATERIALS, 2022
作者:  Liu, Yuqi;  Zhang, Xuemei;  Nan, Pengfei;  Zou, Bo;  Zhang, Qingtang
收藏  |  浏览/下载：25/0  |  提交时间：2022/12/22
Facile synthesis of KaCs1−aPbBr3@ molecular sieve SBA-15 composite with improved luminescence and wet/thermal stability 期刊论文
Colloids and Surfaces A: Physicochemical and Engineering Aspects, 2022, 卷号: 648
作者:  Dong, Qizheng;  Tian, Binglong;  Zhang, Wenbo;  He, Ling
收藏  |  浏览/下载：35/0  |  提交时间：2022/06/20
Screening for shape memory alloys with narrow thermal hysteresis using combined XGBoost and DFT calculation 期刊论文
COMPUTATIONAL MATERIALS SCIENCE, 2022, 卷号: 211, 页码: 7
作者:  Tian, Xiaohua;  Zhou, Liwen;  Zhang, Kun;  Zhao, Qiu;  Li, Hongxing
收藏  |  浏览/下载：36/0  |  提交时间：2022/07/14

Enhanced 3D printed Al2O3 core via in-situ mullite

 期刊论文
ADDITIVE MANUFACTURING, 2022, 卷号: 55, 页码: 14
作者:  Li, Qiaolei;  Meng, Xiantian;  Zhang, Xuechun;  Liang, Jingjing;  Zhang, Chaowei
收藏  |  浏览/下载：28/0  |  提交时间：2022/07/14
Modulation of morphology and electronic structure on MoS2-based electrocatalysts for water splitting 期刊论文
NANO RESEARCH, 2022, 页码: 26
作者:  Liu, Mengmeng;  Zhang, Chunyan;  Han, Ali;  Wang, Ling;  Sun, Yujia
收藏  |  浏览/下载：16/0  |  提交时间：2022/09/16
Modulation of morphology and electronic structure on MoS2-based electrocatalysts for water splitting 期刊论文
NANO RESEARCH, 2022, 页码: 26
作者:  Liu, Mengmeng;  Zhang, Chunyan;  Han, Ali;  Wang, Ling;  Sun, Yujia
收藏  |  浏览/下载：24/0  |  提交时间：2022/09/16
Research on Bi contents addition into Sn-Cu-based lead-free solder alloy 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 19, 页码: 15586-15603
作者:  Huang, Hai;  Chen, Bin;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin
收藏  |  浏览/下载：88/0  |  提交时间：2022/07/19
Simultaneous improvement of magnetic-field-induced working temperature and mechanical properties in Ni-Mn-In shape memory alloy 期刊论文
AIP ADVANCES, 2022, 卷号: 12, 期号: 6, 页码: 8
作者:  Ma, Tianyou;  Zhang, Kun;  Han, Binglun;  Zhao, Lei;  Zhao, Wenbin
收藏  |  浏览/下载：24/0  |  提交时间：2022/07/14

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