CORC

浏览/检索结果: 共5条,第1-5条 帮助

限定条件                    
已选(0)清除 条数/页:   排序方式:
Enhanced Antiwear Property of Cu-Sn-Bi Bimetal Composites with TiB2 under Different Working Conditions 期刊论文
TRIBOLOGY TRANSACTIONS, 2021, 卷号: 65, 期号: 1, 页码: 78-87
作者:  Yang, Dongya;  Li, Zhenyu;  Zhao, Gengrui;  Wang, Honggang;  Ren, Junfang
收藏  |  浏览/下载:31/0  |  提交时间:2021/12/17
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid-liquid electromigration 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载:18/0  |  提交时间:2021/10/14
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration 期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载:12/0  |  提交时间:2022/02/17
Wetting of SiC by molten Cu–20Me–2Cr (Me=Ag, Mn, Si, and Sn) alloys at 1373 K 期刊论文
Vacuum, 2021, 卷号: 185
作者:  Lin, Qiaoli;  Liu, Lu;  Yang, Hongyu;  Li, Liumeng
收藏  |  浏览/下载:2/0  |  提交时间:2021/03/02
Wetting of SiC by molten Cu-20Me-2Cr (Me=Ag, Mn, Si, and Sn) alloys at 1373 K 期刊论文
VACUUM, 2021, 卷号: 185
作者:  Lin, Qiaoli;  Liu, Lu;  Yang, Hongyu;  Li, Liumeng
收藏  |  浏览/下载:3/0  |  提交时间:2021/04/12


©版权所有 ©2017 CSpace - Powered by CSpace