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浏览/检索结果: 共36条，第1-10条 帮助 限定条件 发表日期：2020     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 12, 页码: 4297-4302 作者:  Yu, Weiyuan;  Sun, Jungang;  Liu, Yun;  B., Wu;  Z., Lei 收藏  |  浏览/下载：8/0  |  提交时间：2022/02/17 Binary alloys  Brazing  Brazing filler metals  Grain size and shape  Intermetallics  Melting point  Microstructure  Nanoparticles  Synthesis (chemical)  Brazing joints  Composite solders  Crystal planes  Driving forces  Interfacial intermetallics  Liquidus temperature  Melting process  Melting properties   Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 8 作者:  Yang, Jie;  Zhang, Qingke;  Song, Zhenlun 收藏  |  浏览/下载：133/0  |  提交时间：2021/02/02 SnBi solder  Ag and In addition  microhardness  nano-indentation  impact toughness  fracture mechanism   Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文 Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong 收藏  |  浏览/下载：2/0  |  提交时间：2022/02/17 Activation energy  Copper  Liquids  Microelectronics  Soldering  Thermal gradients  Tin  Ultrasonics  Copper dissolution  Development trends  Dissolution kinetics  Dissolution rates  Enhanced dissolutions  Microelectronic products  Multifunctionality  Sound pressure distribution   Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin 期刊论文 Journal of Electronic Materials, 2020, 卷号: 49, 期号: 11, 页码: 6590-6597 作者:  Sun, Xuemin;  Yu, Weiyuan;  Wang, Yanhong 收藏  |  浏览/下载：8/0  |  提交时间：2020/11/14 Activation energy  Copper  Liquids  Microelectronics  Soldering  Thermal gradients  Tin  Ultrasonics  Copper dissolution  Development trends  Dissolution kinetics  Dissolution rates  Enhanced dissolutions  Microelectronic products  Multifunctionality  Sound pressure distribution   Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs 期刊论文 Vacuum, 2020, 卷号: 180 作者:  Qiu, Hongyu;  Hu, Xiaowu;  Li, Shuang;  Wan, Yongqiang;  Li, Qinglin 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Binary alloys  Copper alloys  Elastic moduli  Fracture  Fracture mechanics  Shear flow  Soldered joints  Surface analysis  Tin alloys  Area ratios  Fracture mechanisms  Fracture surface analysis  Fracture surfaces  Fractured surfaces  Isothermal aging  Lead-free solder joint  Solder joints   Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin 收藏  |  浏览/下载：17/0  |  提交时间：2020/11/14 Bismuth compounds  Diffusion barriers  Gold  Gold compounds  Heat resistance  Microstructure  Nickel  Open circuit voltage  Soldering  Barrier films  Diffusion barrier films  Electrical resistances  Output current  Reflow--soldering  Solder joints  Temperature differences  Thermoelectric   Microstructure induced galvanic corrosion evolution of SAC305 solder alloys in simulated marine atmosphere 期刊论文 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 51, 页码: 40-53 作者:  Wang, Mingna;  Qiao, Chuang;  Jiang, Xiaolin;  Hao, Long;  Liu, Xiahe 收藏  |  浏览/下载：13/0  |  提交时间：2021/02/02 SAC305 solder  Marine atmosphere  Galvanic corrosion  In-situ EIS  Comb-like electrode   Microstructure induced galvanic corrosion evolution of SAC305 solder alloys in simulated marine atmosphere 期刊论文 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2020, 卷号: 51, 页码: 40-53 作者:  Wang, Mingna;  Qiao, Chuang;  Jiang, Xiaolin;  Hao, Long;  Liu, Xiahe 收藏  |  浏览/下载：19/0  |  提交时间：2021/02/02 SAC305 solder  Marine atmosphere  Galvanic corrosion  In-situ EIS  Comb-like electrode   Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint 期刊论文 Journal of Alloys and Compounds, 2020, 卷号: 832 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin 收藏  |  浏览/下载：22/0  |  提交时间：2020/11/14 Bismuth compounds  Diffusion  Electric resistance  Electrodes  Growth rate  IV-VI semiconductors  Microstructure  Scanning electron microscopy  Tin  Tin compounds  Transmission electron microscopy  Diffusion process  Electrical resistances  Micro-structure evolutions  Porous structures  Thermodynamically stable  Thermoelectric  Volume diffusion  X ray diffractometers   Failure Mechanism of the SnAgCu/SnPb Mixed Soldering Process in a Ball Grid Array Structure 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2020, 页码: 9 作者:  Gao, Li-Yin;  Cui, Xian-Wei;  Tian, Fei-Fei;  Liu, Zhi-Quan 收藏  |  浏览/下载：46/0  |  提交时间：2021/02/02 Mixed soldering  ball grid array  solidification  crack  shrinkage  failure mechanism