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Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder 期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 12, 页码: 4297-4302
作者:  Yu, Weiyuan;  Sun, Jungang;  Liu, Yun;  B., Wu;  Z., Lei
收藏  |  浏览/下载:8/0  |  提交时间:2022/02/17
Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs 期刊论文
Vacuum, 2020, 卷号: 180
作者:  Qiu, Hongyu;  Hu, Xiaowu;  Li, Shuang;  Wan, Yongqiang;  Li, Qinglin
收藏  |  浏览/下载:2/0  |  提交时间:2020/11/14


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