CORC

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CORC

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Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
收藏  |  浏览/下载：130/0  |  提交时间：2021/02/02
Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137
作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14
The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration 期刊论文
MATERIALS LETTERS, 2019, 卷号: 256
作者:  Qiu, Hongyu;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin
收藏  |  浏览/下载：14/0  |  提交时间：2019/11/15
Segregation-driven grain boundary spinodal decomposition as a pathway for phase nucleation in a high-entropy alloy 期刊论文
ACTA MATERIALIA, 2019, 卷号: 178, 页码: 1-9
作者:  Li, Linlin;  Li, Zhiming;  da Silva, Alisson Kwiatkowski;  Peng, Zirong;  Zhao, Huan
收藏  |  浏览/下载：14/0  |  提交时间：2021/02/02
Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文
Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602
作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun
收藏  |  浏览/下载：5/0  |  提交时间：2022/02/17
Sialon tailoring copper-based composite to achieve high strength, high strain integrated with excellent wear resistance 期刊论文
Tribology international, 2019, 卷号: 137, 页码: 127-138
作者:  Sun, Qichun;  Wang, Zixi;  Yu, Yuan;  Yang, Jun;  Tan, Hui
收藏  |  浏览/下载：402/0  |  提交时间：2019/10/08
Joining of the C-f/SiC composites by a one-step Si infiltration reaction bonding 期刊论文
MATERIALS CHARACTERIZATION, 2019, 卷号: 155
作者:  Wu, Xishi;  Pei, Bingbing;  Zhu, Yunzhou;  Huang, Zhengren
收藏  |  浏览/下载：47/0  |  提交时间：2019/12/26
Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602
作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun
收藏  |  浏览/下载：2/0  |  提交时间：2019/11/15
Insights on interfacial IMCs growth and mechanical strength of asymmetrical Cu/SAC305/Cu-Co system 期刊论文
VACUUM, 2019, 卷号: 167, 页码: 77-89
作者:  Hu, Xiaowu;  Li, Chao;  Li, Qinglin;  Yi, Guangbin
收藏  |  浏览/下载：5/0  |  提交时间：2019/11/15
Interfacial microstructure evolution and bonding mechanisms of 14YWT alloys produced by hot compression bonding 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2019, 卷号: 35, 期号: 8, 页码: 1671-1680
作者:  Zhou, Liying;  Feng, Shaobo;  Sun, Mingyue;  Xu, Bin;  Li, Dianzhong
收藏  |  浏览/下载：11/0  |  提交时间：2021/02/02

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