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浏览/检索结果: 共48条，第1-10条 帮助 限定条件 发表日期：2019    专题：兰州理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Microstructure Evolution of Ultrasonic-Assisted Electrical Resistance Brazing Joints of 6063 Aluminum Alloys 期刊论文 RARE METAL MATERIALS AND ENGINEERING, 2019, 卷号: 48, 期号: 12, 页码: 4081-4087 作者:  Yu Weiyuan;  Wu Weijie;  Sun Xuemin 收藏  |  浏览/下载：0/0  |  提交时间：2020/06/02 6063 aluminium alloy  ultrasonic-assisted electrical resistance brazing  ultrasonic power  current intensity   Microstructure Evolution of Ultrasonic-Assisted Electrical Resistance Brazing Joints of 6063 Aluminum Alloys 期刊论文 RARE METAL MATERIALS AND ENGINEERING, 2019, 卷号: 48, 期号: 12, 页码: 4081-4087 作者:  Yu Weiyuan;  Wu Weijie;  Sun Xuemin 收藏  |  浏览/下载：0/0  |  提交时间：2022/03/01 6063 aluminium alloy  ultrasonic-assisted electrical resistance brazing  ultrasonic power  current intensity   Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137 作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14 Atomic force microscopy  Coatings  Copper compounds  Electroplating  Gold  Growth rate  Lead-free solders  Metallic films  Scanning electron microscopy  Semiconductor doping  Silver alloys  Silver metallography  Soldering  Substrates  Surface roughness  Ternary alloys  Thermal aging  Tin alloys  Tin compounds  Tin metallography  X ray photoelectron spectroscopy  Benzotriazole(BTA)  Electroplated Cu films  Heterocyclic compound  Interfacial microstructure evolution  Isothermal aging  Kovar substrates  Low concentrations  Soldering process   Phase Transformation Strengthening of Hot Extruded Inconel 625 under High-temperature Load Environment 期刊论文 Journal Wuhan University of Technology, Materials Science Edition, 2019, 卷号: 34, 期号: 6, 页码: 1297-1308 作者:  Liu, Dexue;  Cui, Maomao;  Wang, Wenxu;  Nan, Hongqiang;  Cai, Haopeng 收藏  |  浏览/下载：9/0  |  提交时间：2022/02/17 Carbides  Chromium compounds  Creep  Creep resistance  Grain boundaries  Phase transitions  Creep temperature  High temperature  Inconel 625 alloys  Large amounts  M23C6 carbides  Micro-structure evolutions  Strength increase  Temperature sensitive   The effects of Ni addition on microstructure evolution and mechanical properties of solder joints undergoing solid-liquid electromigration 期刊论文 MATERIALS LETTERS, 2019, 卷号: 256 作者:  Qiu, Hongyu;  Hu, Xiaowu;  Jiang, Xiongxin;  Li, Qinglin 收藏  |  浏览/下载：14/0  |  提交时间：2019/11/15 Grain orientation  Electromigration  Intermetallic compounds  Diffusion   Nanoporous Ni and NiO Prepared by De-alloying as Anodes for Electrocatalytic Oxygen Evolution Reaction 期刊论文 Cailiao Daobao/Materials Reports, 2019, 卷号: 33, 期号: 11, 页码: 3701-3707 作者:  Zhou, Qi;  Ren, Xiangrong 收藏  |  浏览/下载：13/0  |  提交时间：2022/02/17 Activation energy  Alloying  Aluminum alloys  Anodes  Binary alloys  Current density  Cyclic voltammetry  Dealloying  Morphology  Musculoskeletal system  Nickel metallography  Nickel oxide  Oxygen  Oxygen evolution reaction  Pore size  Rapid quenching  Anode material  Apparent activation energy  Electrocatalytic properties  Electrochemical impendence spectroscopies  Electrochemical performance  Electrolysis of waters  Exchange current densities  Nano-porous   Nanoporous Ni and NiO Prepared by De-alloying as Anodes for Electrocatalytic Oxygen Evolution Reaction 期刊论文 Cailiao Daobao/Materials Reports, 2019, 卷号: 33, 期号: 11, 页码: 3701-3707 作者:  Zhou, Qi;  Ren, Xiangrong 收藏  |  浏览/下载：2/0  |  提交时间：2020/11/14 Activation energy  Alloying  Aluminum alloys  Anodes  Binary alloys  Current density  Cyclic voltammetry  Dealloying  Morphology  Musculoskeletal system  Nickel metallography  Nickel oxide  Oxygen  Oxygen evolution reaction  Pore size  Rapid quenching  Anode material  Apparent activation energy  Electrocatalytic properties  Electrochemical impendence spectroscopies  Electrochemical performance  Electrolysis of waters  Exchange current densities  Nano-porous   Semi-solid Microstructure Evolution of Mg-6Zn-1Cu-0.3Mn Magnesium Alloy 期刊论文 Cailiao Daobao/Materials Reports, 2019, 卷号: 33, 期号: 10, 页码: 3441-3447 作者:  Huang, Xiaofeng;  Zhang, Qiaoqiao;  Ma, Yajie;  Wei, Langlang;  Yang, Jianqiao 收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14 Copper alloys  Grain boundaries  Heat treatment  Isotherms  Manganese alloys  Microstructure  Particle size  Remelting  Spheres  Zinc alloys  Average particle size  Heat preservation time  Heat treatment parameters  Isothermal heat treatments  Micro-structure evolutions  Ostwald ripening mechanism  Semi-solids  Spherical evolution   Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun 收藏  |  浏览/下载：6/0  |  提交时间：2022/02/17 Binary alloys  Copper compounds  Interface states  Intermetallics  Lead-free solders  Microstructure  Phase interfaces  Soldering  Tin compounds  Ultrasonic effects  Unmanned aerial vehicles (UAV)  Formation and evolutions  Growth patterns  IMC layer  Interfacial intermetallics  Liquid interface  Nonequilibrium state  Ultrasonic vibration   Crack propagation mechanism of gamma-TiAl alloy with pre-existing twin boundary 期刊论文 SCIENCE CHINA-TECHNOLOGICAL SCIENCES, 2019, 卷号: 62, 期号: 9, 页码: 1605-1615 作者:  Cao Hui;  Rui ZhiYuan;  Chen WenKe;  Feng RuiCheng;  Yan ChangFeng 收藏  |  浏览/下载：1/0  |  提交时间：2019/11/15 crack propagation  gamma-TiAl  twin boundary  molecular dynamics  deformation mechanism