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科研机构
北京航空航天大学 [3]
山东大学 [3]
江苏大学 [2]
深圳先进技术研究院 [2]
武汉大学 [2]
大连理工大学 [1]
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内容类型
会议论文 [15]
发表日期
2016 [15]
学科主题
chemical r... [1]
lasers [1]
materials ... [1]
semiconduc... [1]
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浏览/检索结果:
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发表日期:2016
内容类型:会议论文
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Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode
会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:
Nie, Zhiqiang
;
Wu, Di
;
Lu, Yao
;
Wu, Dhai
;
Wang, Shuna
收藏
  |  
浏览/下载:85/0
  |  
提交时间:2016/11/22
Chip scale packages
Defects
Degradation
Electronics packaging
High power lasers
Laser beam welding
Power semiconductor diodes
Reliability
Reliability analysis
Semiconductor diodes
Comparative study of anhydride-based and amine-based underfill materials for flip chip applications
会议论文
China Semiconductor Technology International Conference 2016, CSTIC 2016, Shanghai, China
作者:
Gang Li
;
Pengli Zhu
;
Qian Guo
;
Tao Zhao
;
Daniel Lu
收藏
  |  
浏览/下载:13/0
  |  
提交时间:2017/01/15
Development and Application of Polymer-based Nanocomposite Dielectrics
会议论文
The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China
作者:
Suibin Luo
;
Shuhui Yu
;
Rong Sun
;
Ching-Ping Wong
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2017/01/15
Neighborhood Similarity-Based Color Transfer Algorithm
会议论文
作者:
Cao, Liqin
;
Li, Yanhao
;
Li, Zhijiang
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/12/05
Color transfer
Welsh algorithm
Point neighborhood features
Experimental Investigation of Paraffin Wax with Graphene Enhancement as Thermal Management Materials for Batteries
会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), 2016-08-16
作者:
Zhang, Yan[1]
;
Yue, Wang[2]
;
Zhang, Shaochun[3]
;
Huang, Shirong[4]
;
Liu, Johan[5]
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/04/26
thermal performance
graphene
paraffin wax
Study on the electromigration-induced failure mechanism of Sn-3.0Ag-0.5Cu BGA solder balls
会议论文
17th International Conference on Electronic Packaging Technology, ICEPT 2016, 2016-08-16
作者:
Qiu Y.
;
Huang M.
;
Wu A.
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/09
Thermal-structural Optimization of Light with LED Packaging
会议论文
Symposium on Wide Bandgap Semiconductor Materials and Devices 17 held during the 229th Meeting of The Electrochemical-Society, 2016-05-29
作者:
Zhang, L.Q.[1]
;
Li, L.Y.[2]
;
Ge, D.H.[3]
;
Zhu, X.D.[4]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/24
Numerical Investigation on Atomic Migration Effect on Thermal Conductivity of Al/Cu Interface Structures in Electronic Interconnection Packaging
会议论文
7th International Symposium on Dielectrics for Nanosystems - Materials Science, Processing, Reliability and Manufacturing held as part of the 229th Meeting of The Electrochemical-Society, 2016-05-29
作者:
Zhang, L. Q.[1]
;
Ge, D. H.[2]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/24
Improved Local Adaptive Image Enhancement Algorithm Based on Lee Algorithm
会议论文
作者:
Song, Tian
;
Li, Zhijiang
;
Cao, Liqin
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/05
Image enhancement
Lee algorithm
Logarithm transform
Plateau histogram equalization
Preparation water dispersible reduced graphene oxide as ink materials for the flexible and wearable energy storage devices
会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), AUG 16-19, 2016
作者:
Su, Haibo
;
Zhu, Pengli
;
Zhou, Fengrui
;
Han, Yankang
;
Shuai, Xingtian
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/31
water dispersible reduced graphene oxide
ink material
flexible device
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