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CORC

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Thermally accelerated ageing test of 808nm high power diode laser arrays in CW mode 会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:  Nie, Zhiqiang;  Wu, Di;  Lu, Yao;  Wu, Dhai;  Wang, Shuna
收藏  |  浏览/下载：85/0  |  提交时间：2016/11/22
Numerical simulation of thermo-mechanical behavior in high power diode laser arrays 会议论文
17th international conference on electronic packaging technology, icept 2016, wuhan, china, 2016-08-16
作者:  Lu, Yao;  Nie, Zhiqiang;  Zhang, Pu;  Wang, Zhenfu;  Xiong, Lingling
收藏  |  浏览/下载：40/0  |  提交时间：2016/11/22
High-resolution Artificial Retina Project in SIAT-CAS 会议论文
Optofluidics2016, Beijing
作者:  Tianzhun Wu
收藏  |  浏览/下载：25/0  |  提交时间：2017/01/15
Fabrication and Characterization of Low Stress Si Interposer with Air-gapped Si Interconnection for Hermetical System-in-Package 会议论文
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), Las Vegas, NV
作者:  Luo, Rongfeng;  Ren, Kuili;  Ma, Shenglin;  Yan, Jun;  Xia, Yanming
收藏  |  浏览/下载：42/0  |  提交时间：2017/01/15
THE JOINT SCHEDULING OF EV CHARGING LOAD WITH BUILDING MOUNTED WIND POWER USING SIMULATION-BASED POLICY IMPROVEMENT 会议论文
作者:  Yang, Yu;  Jia, Qing-Shan;  Guan, Xiaohong
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Design and Research of ultra-miniature pressure sensors 会议论文
作者:  Wang, Bing;  Zhao, Yulong;  Cheng, Xinli;  Wang, Wenxiang
收藏  |  浏览/下载：2/0  |  提交时间：2019/11/26
A Matlab Interface Package for Elegant Simulation Code 会议论文
Proceedings of the 7th International Particle Accelerator Conference, Korea, 2016
作者:  V.V.Smaluk,T.V.Shaftan;  G.M.Wang
收藏  |  浏览/下载：14/0  |  提交时间：2016/07/13
A Software Toolkit to Study Systematic Uncertainties of the Physics Models of the Geant4 Simulation Package 会议论文
Chicago, USA, 2016
作者:  Krzysztof Genser;  Robert Hatcher;  Gabriel Perdue;  Hans Wenzel;  Julia Yarba
收藏  |  浏览/下载：9/0  |  提交时间：2017/06/13
Aberrant Arcuate Fasciculus in Schizophrenia with Auditory Verbal Hallucination: A Multi-site Study 会议论文
Geneva, Switzerland, 20160626-20160630
作者:  Xie, Sangma;  Wang, Jiaojian;  Tao, Yan;  Fan, Lingzhong;  Liu, Bing
收藏  |  浏览/下载：30/0  |  提交时间：2017/01/06
Packaging of Hard Solder 500W QCW Diode Laser Array 会议论文
conference on components and packaging for laser systems ii, san francisco, ca, 2016-02-16
作者:  Li, Xiaoning;  Wang, Jingwei;  Hou, Dong;  Nie, Zhiqiang;  Liu, Xingsheng
收藏  |  浏览/下载：11/0  |  提交时间：2016/10/18

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