基于机器视觉的晶圆预定位装置及方法
吴清潇; 欧锦军; 朱枫; 郝颖明; 付双飞; 苗锡奎
2013-07-24
专利国别中国
专利号CN103219269A
专利类型发明
产权排序1
权利人中国科学院沈阳自动化研究所
其他题名Wafer pre-locating device based on machine vision and method thereof
中文摘要本发明涉及基于机器视觉的晶圆预定位装置及方法,其装置包括真空吸附式晶圆上料台、图像采集处理单元、大幅面红外面光源和二维微动平台系统。其方法包括以下步骤:晶圆上料;采集晶圆图像;边缘提取;晶圆圆心拟合;晶圆位置调整。本发明避免了对晶圆边缘的损伤;具有不作任何调整,能同时满足晶圆精确定位的优点;同时,该装置结构简单,成本较低,能满足IC装备制造中对晶圆预定位的需求。
是否PCT专利
英文摘要The invention relates to a wafer pre-locating device based on machine vision and a method thereof. The device comprises a vacuum-absorbing type wafer feeding table, an image collecting and processing unit, a large-format infrared face area light source and a two-dimension micro-motion platform system. The method comprises the steps of feeding wafers, collecting images of the wafers extracting edges fitting circle centers of the wafers and adjusting positions of the wafers. The device and the method avoid damage to the edges of the wafers, and have the advantages of being free of any adjustment and capable of meeting requirements for accurate location of the wafers. Meanwhile, the device is simple in structure, low in cost, and capable of meeting requirements of manufacture of IC equipment for pre-location of the wafers.
申请日期2012-01-19
语种中文
专利申请号CN201210017565.1
专利代理沈阳科苑专利商标代理有限公司 21002
内容类型专利
源URL[http://ir.sia.cn/handle/173321/13538]  
专题沈阳自动化研究所_光电信息技术研究室
推荐引用方式
GB/T 7714
吴清潇,欧锦军,朱枫,等. 基于机器视觉的晶圆预定位装置及方法. CN103219269A. 2013-07-24.
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