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CORC

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Materials, processing and reliability of low temperature bonding in 3D chip stacking 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 750, 页码: 980-995
作者:  Zhang, L;  Liu, ZQ;  Chen, SW;  Wang, YD;  Long, WM
收藏  |  浏览/下载：18/0  |  提交时间：2018/12/25
The diffusion barrier effect of Fe-Ni UBM as compared to the commercial Cu UBM during high temperature storage 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2018, 卷号: 739, 页码: 632-642
作者:  Gao, LY;  Li, CF;  Wan, P;  Zhang, H;  Liu, ZQ
收藏  |  浏览/下载：24/0  |  提交时间：2018/06/05
Failure behavior of flip chip solder joint under coupling condition of thermal cycling and electrical current 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 6, 页码: 5025-5033
作者:  Zhu, QS;  Gao, F;  Ma, HC;  Liu, ZQ;  Guo, JD
收藏  |  浏览/下载：20/0  |  提交时间：2018/06/05
The facile synthesis, crystallization behavior and magnetic property of FeNiP amorphous nanoparticles 期刊论文
MATERIALS CHARACTERIZATION, 2018, 卷号: 136, 页码: 94-99
作者:  Yuan, J;  Li, CF;  Yang, B;  Liu, ZQ;  Liu, ZQ (reprint author), Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Liaoning, Peoples R China.
收藏  |  浏览/下载：15/0  |  提交时间：2018/06/05

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