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浏览/检索结果: 共5条，第1-5条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Effects of flux activators and processing parameters on solderability and stability of the aluminum solder paste used for automated assembly (CPCI-S收录) 会议 作者:  Zhang, Lang;  Zhou, Min-Bo;  Qiu, Fu-Shun;  Ma, Xiao;  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 aluminum solder paste  activator  processing parameter  solderability  stability  LED assembly   Dynamic wetting behavior and solder ball spattering formation of Sn-Bi solder pastes during reflow soldering process (CPCI-S收录) 会议 作者:  Tan, Meng-Ying;  Zhou, Min-Bo;  Huang, Lia-Qiang;  Ma, Fa-Qian;  Ma, Xiao 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 surface defect  solder ball spattering  Sn-Bi solder paste  reflow soldering process   Influence of the solder volume and reflow process on solderability of the aluminum solder paste and reliability of Sn-0.3Ag-0.7Cu/6061Al sold (CPCI-S收录) 会议 作者:  Lin, Yuan-Jiang[1];  Zhou, Min-Bo[1];  Ma, Xiao[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 Aluminum solder paste  reflow process  soldering parameter  reliability   Influence of metal-oxide/salt content in the aluminum soldering flux on solderability and corrosion resistance of Sn-0.7Cu/6061Al joints (CPCI-S收录) 会议 作者:  Zhou, Min-Bo[1];  Zhou, Li-Bing[1];  Zhang, Lang[1];  Qiu, Fu-Shun[1];  Ma, Xiao[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 aluminum soldering flux  Sn-0.7Cu solder wire  solderability  corrosion resistance  solder joint   Viral integration signature in multifocal hepatocellular carcinoma during occult hepatitis B virus infection: a single-cell sequencing analys (CPCI-S收录) 会议 作者:  Wu, Han-Jie[1];  Xia, Yu-Dong[1];  Liang, Hui-Fang[2];  Laurence, Arian[3];  Li, Wei-Yang[4] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/11