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Grain Boundaries Softening Thermoelectric Oxide BiCuSeO 期刊论文
ACS Applied Materials and Interfaces, 2018, 卷号: 10, 期号: 7, 页码: 6772-6777
作者:  Li, Guodong*;  Hao, Shiqiang;  Morozov, Sergey I.;  Zhai, Pengcheng;  Zhang, Qingjie*
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/04
Ductile deformation mechanism in semiconductor alpha-Ag2S 期刊论文
npj Computational Materials, 2018, 卷号: 4, 期号: 1, 页码: 44-npj Computational Materialsvolume 4, Article number: 44
作者:  Li, Guodong*;  An, Qi;  Morozov, Sergey I.;  Duan, Bo;  Goddard, William A., III
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/04
Determining ideal strength and failure mechanism of thermoelectric CuInTe2 through quantum mechanics 期刊论文
Journal of Materials Chemistry A, 2018, 卷号: 6, 期号: 25, 页码: 11743-11750
作者:  Li, Guodong*;  An, Qi;  Morozov, Sergey I.;  Duan, Bo;  Zhai, Pengcheng
收藏  |  浏览/下载:8/0  |  提交时间:2019/12/04
Mechanical properties in thermoelectric oxides: Ideal strength, deformation mechanism, and fracture toughness 期刊论文
Acta Materialia, 2018, 卷号: 149, 页码: 341-349
作者:  Li, Guodong*;  Aydemir, Umut;  Morozov, Sergey I.;  Miller, Samuel A.;  An, Qi
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/04
Mechanical softening of thermoelectric semiconductor Mg2Si from nanotwinning 期刊论文
Scripta Materialia, 2018, 卷号: 157, 页码: 90-94
作者:  Li, Guodong*;  An, Qi;  Morozov, Sergey I.;  Duan, Bo;  Goddard, William A., III
收藏  |  浏览/下载:14/0  |  提交时间:2019/12/04


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