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STUDY ON PRECIPITATION AND DISSOLUTION OF INTERFACIAL CU6SN5 DURING THERMOMIGRATION 会议论文
China Semiconductor Technology International Conference (CSTIC), Shanghai, PEOPLES R CHINA, 2016-03-13
作者:  Zhong, Yi;  Huang, Mingliang;  Deng, Jianfeng;  Ma, Haitao;  Dong, Wei
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/09
Synchrotron radiation in situ study on the solidification of Cu/Sn-58Bi/Cu solder joint under temperature gradient 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Zhao, Ning;  Zhong, Yi;  Huang, Mingliang;  Ma, Haitao;  Dong, Wei
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/09
Interfacial reaction of Ni/Sn-9Zn/Ni solder joint undergoing liquid-solid thermomigration 会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, 2016-08-16
作者:  Zhao, Ning;  Deng, Jianfeng;  Zhong, Yi;  Huang, Mingliang;  Ma, Haitao
收藏  |  浏览/下载：6/0  |  提交时间：2019/12/09
Interfacial reactions of Ni/Sn-9Zn/Ni solder joint undergoing liquid-solid thermomigration 会议论文
17th International Conference on Electronic Packaging Technology Wuhan
作者:  Zhao N(赵宁);  Huang ML(黄明亮);  Ma HT(马海涛)
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09
Microstructure and interfacial reactions on Sn-Au-Ag solder joints on Cu and Ni substrates 会议论文
17th International Conference on Electronic Packaging Technology Wuhan
作者:  Huang ML(黄明亮);  Zhao N(赵宁)
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
Optimization Method of Parallel Processing for Remote Sensing Image Cloud Detection 会议论文
28th Chinese Control and Decision Conference, MAY 28-30, 2016
作者:  Li Zhao;  Li Yede;  Gao Mingliang
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/31
Optimization method of parallel processing for remote sensing image cloud detection 会议论文
28th Chinese Control and Decision Conference, CCDC 2016, May 28, 2016 - May 30, 2016
作者:  Zhao, Li;  Yede, Li;  Gao, Mingliang
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/31
Effect of Sn grain orientation on Cu diffusion in SnAgCu solder interconnect undergoing electromigration 会议论文
16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11
作者:  Zhao, Jianfei;  Huang, Mingliang;  Zhao, Ning;  Zhang, Zhijie
收藏  |  浏览/下载：25/0  |  提交时间：2019/12/09
Synchrotron radiation in situ study on liquid-solid thermomigration in Cu/Sn/Ni solder joint 会议论文
16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11
作者:  Zhong, Yi;  Huang, Mingliang;  Ma, Haitao;  Zhao, Ning
收藏  |  浏览/下载：13/0  |  提交时间：2019/12/09
Interfacial reactions in Cu/Sn/Cu(Ni) systems during soldering under temperature gradient 会议论文
16 int conf elect packaging technology, Chinese Inst Elect,China IEEE Component Packaging, & Mfg Tech Soci IEEE-C, Changsha, PEOPLES R CHINA, 2015-08-11
作者:  Zhao, Ning;  Zhong, Yi;  Huang, Mingliang;  Ma, Haitao
收藏  |  浏览/下载：1/0  |  提交时间：2019/12/09

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