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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 专题：兰州理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Influences of different barrier films on microstructures and electrical properties of Bi2Te3-based joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 17, 页码: 14714-14729 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin 收藏  |  浏览/下载：16/0  |  提交时间：2020/11/14 Bismuth compounds  Diffusion barriers  Gold  Gold compounds  Heat resistance  Microstructure  Nickel  Open circuit voltage  Soldering  Barrier films  Diffusion barrier films  Electrical resistances  Output current  Reflow--soldering  Solder joints  Temperature differences  Thermoelectric   Effects of the Ni electrodeposit on microstructure evolution and electrical resistance of the P-type Bi2Te3 solder joint 期刊论文 Journal of Alloys and Compounds, 2020, 卷号: 832 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin 收藏  |  浏览/下载：20/0  |  提交时间：2020/11/14 Bismuth compounds  Diffusion  Electric resistance  Electrodes  Growth rate  IV-VI semiconductors  Microstructure  Scanning electron microscopy  Tin  Tin compounds  Transmission electron microscopy  Diffusion process  Electrical resistances  Micro-structure evolutions  Porous structures  Thermodynamically stable  Thermoelectric  Volume diffusion  X ray diffractometers   Effects of the Ni(P) plating thickness on microstructure evolution of interfacial IMCs in Sn–58Bi/Ni(P)/Cu solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2020, 卷号: 31, 期号: 14, 页码: 11470-11481 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Zhang, Zhe;  Li, Qinglin 收藏  |  浏览/下载：5/0  |  提交时间：2020/11/14 Binary alloys  Diffusion  Growth rate  Soldering  Atomic diffusions  Compound layer  Diffusion channels  Diffusion process  Micro-structure evolutions  Plating thickness  Solder joint reliability  Solder joints   Influences of Ni addition into Cu–xNi alloy on the microstructure evolution and mechanical property of Sn–58Bi/Cu–xNi solder joint 期刊论文 Applied Physics A: Materials Science and Processing, 2020, 卷号: 126, 期号: 4 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin;  Jiang, Xiongxin 收藏  |  浏览/下载：4/0  |  提交时间：2020/11/14 Ductile fracture  Microstructure  Soldering  Fracture mechanisms  IMC layer  Liquid-state reaction  Micro-structure evolutions  Ni additions  Reflow--soldering  Solder joints  Synergistic effect   Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi2(Te,Se)3 thermoelectric material 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 15, 页码: 14791-14804 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin 收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14 Crystal orientation  Deterioration  Electrodes  Substrates  Thermoelectric equipment  Aging treatment  Brittle failures  Cu electrodeposits  Interfacial contact  Isotropic microstructures  Solder joints  Spreadability  Thermo-Electric materials   Influence of Ni and Cu electrodeposits on the interfacial reaction between SAC305 solder and the Bi-2(Te,Se)(3) thermoelectric material 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 15, 页码: 14791-14804 作者:  Cheng, Jinxuan;  Hu, Xiaowu;  Li, Qinglin 收藏  |  浏览/下载：7/0  |  提交时间：2019/11/15