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High Power Diode Laser Array Development using Completely Indium Free Packaging Technology with Narrow Spectrum 会议论文
conference on components and packaging for laser systems ii, san francisco, ca, 2016-02-16
作者:  Hou, Dong;  Wang, Jingwei;  Gao, Lijun;  Liang, Xuejie;  Li, Xiaoning
收藏  |  浏览/下载:15/0  |  提交时间:2016/10/18
Packaging of Hard Solder 500W QCW Diode Laser Array 会议论文
conference on components and packaging for laser systems ii, san francisco, ca, 2016-02-16
作者:  Li, Xiaoning;  Wang, Jingwei;  Hou, Dong;  Nie, Zhiqiang;  Liu, Xingsheng
收藏  |  浏览/下载:10/0  |  提交时间:2016/10/18


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