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浏览/检索结果: 共6条，第1-6条 帮助 限定条件 内容类型：会议论文    专题：北京航空航天大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Energy-efficient Analog Processing Architecture for Direction of Arrival with Microphone Array 会议论文 18th IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2019, Miami, FL, United states, 2019-07-15 作者:  Liu, Changlu;  Lan, Tianxiang;  Li, Qin;  Jia, Kaige;  Fan, Yidian 收藏  |  浏览/下载：13/0  |  提交时间：2019/12/30 Development and Application of a Micro-infrared Photoelasticity System for Stress Evaluation of Through-silicon Vias (TSV) 会议论文 2015 IEEE 65TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2015-01-01 作者:  Su, Fei;  Lan, Tianbao;  Pan, Xiaoxu;  Zhang, Zheng 收藏  |  浏览/下载：2/0  |  提交时间：2020/01/06 Through-Silicon Vias (TSV)  stress  infrared photoelasticity  finite element analysis  hybrid method   The effect of stress on the mean time to failure (MTTF) of solder under electromigration 会议论文 2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015-01-01 作者:  Pan, Xiaoxu;  Lan, Tianbao;  Su, Fei 收藏  |  浏览/下载：4/0  |  提交时间：2020/01/06 electromigration  electronic packaging  tensile and compressive stress  reliability   Experimental and Finite Elemental Investigations on Residual Stress of TSV 会议论文 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014-01-01 作者:  Su, Fei;  Lan, Tianbao;  Zhu, Yunhui;  Chen, Jing 收藏  |  浏览/下载：3/0  |  提交时间：2020/01/06 Through Silicon Via (TSV)  Stress  Photo-elasticity  Finite element method   Thermo-mechanical Reliability of 3D package under different thermal cycling 会议论文 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014-01-01 作者:  Lan, Tianbao;  Su, Fei 收藏  |  浏览/下载：2/0  |  提交时间：2020/01/06 three-dimensional package  finite element  solder joint  fatigue life   Modeling and High Performance Computing Analysis of Three-Dimensional Electromagnetic Environment 会议论文 SYSTEM SIMULATION AND SCIENTIFIC COMPUTING, PT II, 2012-01-01 作者:  Wu, Yingnian;  Zhang, Lin;  Tao, Fei;  Shen, Yuewei;  Liu, Dengkun 收藏  |  浏览/下载：4/0  |  提交时间：2020/01/06 Electromagnetic environment simulation  High performance computing  Cloud computing