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Microstructure and stress-rupture property of DD32 nickel-based single crystal superalloy fabricated by additive manufacturing 会议论文
作者:  Ci, Shiwei;  Liang, Jingjing;  Li, Jinguo;  Wang, Haiwei;  Zhou, Yizhou
收藏  |  浏览/下载：9/0  |  提交时间：2020/12/18
A High-Performance Annularly Stacked Laser Diode Pump 会议论文
ELECTR NETWORK, 2020-10-12
作者:  Li, Junli;  Sun, Lichen;  Liu, Ming;  Han, Yang;  Fu, Tuanwei
收藏  |  浏览/下载：16/0  |  提交时间：2021/04/15
Development of High Power Annular Diode Laser Array Using Hard Solder 会议论文
San Francisco, CA, 2019-02-04
作者:  Hou, Dong;  Sun, Lichen;  Fu, Tuanwei;  Chen, Li;  Liang, Xuejie
收藏  |  浏览/下载：52/0  |  提交时间：2019/06/28
Experimental and theoretical analysis of the effect of packaging induced thermal stress on high-power laser diode arrays 会议论文
San Francisco, CA, United states, 2019-02-03
作者:  Zhang, Hongyou;  Zah, Chung-En;  Liu, Xingsheng
收藏  |  浏览/下载：38/0  |  提交时间：2019/07/08
Stress intensity simulation of printed circuit heat exchanger for S-CO2 brayton cycle 会议论文
作者:  Wang, Jian;  Sun, Yuwei;  Lu, Mingjian;  Yan, Xinping;  Wang, Jiawei
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/05
High-power low-smile vertically-stacked laser diode based on microchannel cooling 会议论文
Hangzhou, China, 2019-10-21
作者:  Zhang, Hongyou;  Cai, Lei;  Zah, Chung-En;  Liu, Xingsheng
收藏  |  浏览/下载：1/0  |  提交时间：2020/03/04
Effects of upstream step geometry on axisymmetric converging vane endwall secondary flow and heat transfer at transonic conditions 会议论文
作者:  Li, Zhigang;  Liu, Luxuan;  Li, Jun;  Sibold, Ridge A.;  Ng, Wing F.
收藏  |  浏览/下载：35/0  |  提交时间：2019/11/19
A study of Residual Stress in Rolled Copper before and after Heat Treatment 会议论文
The 17th International Manufacturing Conference in China
作者:  Bai Q(白倩)
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03
Investigation of heat transfer and thermal stress during sapphire crystal growth process by heat exchanger method: Evaluation of radiation models 会议论文
作者:  Ma, Wencheng;  Liu, Lijun
收藏  |  浏览/下载：13/0  |  提交时间：2019/11/26
Temperature and thermal stress evolutions in sapphire crystal during the cooling process by heat exchanger method 会议论文
作者:  Ma, Wencheng;  Zhao, Wenhan;  Wu, Ming;  Ding, Guoqiang;  Liu, Lijun
收藏  |  浏览/下载：4/0  |  提交时间：2019/11/26

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