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Communication-Electrodeposition of Nano-Twinned Cu in Void-Free Filling for Blind Microvia of High Density Interconnect 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018, 卷号: 166, 期号: 1, 页码: D3097-D3099
作者:  Zhu, QS;  Zhang, X;  Li, SJ;  Liu, CZ;  Li, CF
收藏  |  浏览/下载:25/0  |  提交时间:2018/12/25
Effect of Reverse Pulse on Additives Adsorption and Copper Filling for Through Silicon Via 期刊论文
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2018, 卷号: 166, 期号: 1, 页码: D3006-D3012
作者:  Zhu, QS;  Zhang, X;  Liu, CZ;  Liu, HY
收藏  |  浏览/下载:18/0  |  提交时间:2018/12/25
Organic Polysulfides Based on -S-S-S- Structure as Additives or Cosolvents for High Performance Lithium-Sulfur Batteries 期刊论文
CHEMELECTROCHEM, 2018, 卷号: 5, 期号: 13, 页码: 1717, 1723
作者:  Gu, Sui;  Jin, Jun;  Zhuo, Shangjun;  Qian, Rong;  Wen, Zhaoyin
收藏  |  浏览/下载:23/0  |  提交时间:2018/12/28


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