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Microstructure of the tungsten and reduced activation ferritic-martensitic steel joint brazed with an Fe-based amorphous alloy 期刊论文
FUSION ENGINEERING AND DESIGN, 2019, 卷号: 138, 页码: 164-169
作者:  Wang, J. B.;  Lian, Y. Y.;  Feng, F.;  Chen, Z.;  Tan, Y.
收藏  |  浏览/下载：18/0  |  提交时间：2019/12/02
Vacuum brazing of Ti6Al4V alloy to 316L stainless steel using a Ti-Cu-based amorphous filler metal 期刊论文
JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2019, 卷号: 269, 页码: 35-44
作者:  Xia, Yueqing;  Dong, Honggang;  Hao, Xiaohu;  Li, Peng;  Li, Shuai
收藏  |  浏览/下载：23/0  |  提交时间：2019/12/02
Microstructure evolution of TC4 titanium alloy/316L stainless steel dissimilar joint vacuum-brazed with Ti-Zr-Cu amorphous filler metal 期刊论文
WELDING IN THE WORLD, 2019, 卷号: 63, 页码: 323-336
作者:  Xia, Yueqing;  Dong, Honggang;  Hao, Xiaohu;  Li, Shuai;  Li, Peng
收藏  |  浏览/下载：37/0  |  提交时间：2019/12/02
Interfacial microstructure and mechanical property of TC4 titanium alloy/316L stainless steel joint brazed with Ti-Zr-Cu-Ni-V amorphous filler metal 期刊论文
JOURNAL OF MANUFACTURING PROCESSES, 2018, 卷号: 35, 页码: 382-395
作者:  Xia, Yueqing;  Li, Peng;  Hao, Xiaohu;  Dong, Honggang
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02
Development of WC-Ni cermet brazing process 期刊论文
Materials Performance, 2018, 卷号: 57, 页码: 30-33
作者:  Joo, Hyung Goun;  Lee, Kang Yong;  Luo, Guo Ming;  Zhang, Da Quan
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
A Ti-Fe-Sn thin film assembly for joining tungsten and reduced activation ferritic-martensitic steels 期刊论文
MATERIALS & DESIGN, 2017, 卷号: 125, 页码: 55-61
作者:  Zhu, Wen;  Qiang, Jianbing;  Wang, Yingmin;  Sun, Jizhong;  Wang, Jianbao
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/02
The combined erosion and corrosion resistance of WC-Ni vacuum brazed coating 期刊论文
ANTI-CORROSION METHODS AND MATERIALS, 2017, 卷号: 64, 页码: 626-633
作者:  Joo, Hyung Goun;  Lee, Kang Yong;  Luo, Guo Ming;  Zhang, Da Quan
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/03
CuTiNiZrV Amorphous Alloy Foils for Vacuum Brazing of TiAl Alloy to 40Cr Steel 期刊论文
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2015, 卷号: 31, 页码: 217-222
作者:  Dong, Honggang;  Yang, Zhonglin;  Wang, Zengrui;  Deng, Dewei;  Dong, Chuang
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09
Three-dimensional packaging involves utilizing metal and brazing filler metal, providing brazing filler material with through hole, and then heating obtained product to carry out brazing reaction. 专利
申请日期: 2015-01-01, 公开日期: 2015-06-10
作者:  HUANG M ZHAO J ZHAO N ZHONG Y YAO M
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
Intermetallic compound bonding method used for three-dimensional package chip stack, comprises putting solder and filler metal on both sides of metal bumps, heating, and brazing. 专利
申请日期: 2015-01-01, 公开日期: 2015-06-17
作者:  HUANG M MA H ZHAO J ZHAO N ZHONG Y
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09

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