CORC

浏览/检索结果: 共362条,第1-10条 帮助

限定条件    
已选(0)清除 条数/页:   排序方式:
Gamma-ray performance study of the HERD payload 会议论文
Virtual, Berlin, Germany, 2021-07-12
作者:  Adriani, O.;  Alemanno, F.;  Aloisio, R.;  Altomare, C.;  Ambrosi, G.
收藏  |  浏览/下载:19/0  |  提交时间:2023/01/16
Emergency Information Transmission Based on BeiDou (BD) Short Message System 会议论文
Strasbourg, France, 2021-04-28
作者:  Dong L(董亮);  Mao, Jingjing;  Pincan;  Chen, Jinou;  Pu, Changqin
收藏  |  浏览/下载:48/0  |  提交时间:2021/05/31
Advances in G-stack diode laser using macro-channel water cooling and high thermal conductivity material packaging 会议论文
Virtual, Online, United states, 2021-03-06
作者:  Han, Yang;  Sun, Lichen;  Fu, Tuanwei;  Gao, Lijun;  Zheng, Yanfang
收藏  |  浏览/下载:31/0  |  提交时间:2021/06/28
Application of open foam in numerical simulations of high-speed trains aerodynamics 会议论文
Virtual, Online, 10 August 2021 到 12 August 2021
作者:  Lu PP(卢攀攀);  Yin B(银波);  Yang GW(杨国伟);  Ji ZL(纪占玲)
收藏  |  浏览/下载:6/0  |  提交时间:2021/11/30
A High-Performance Annularly Stacked Laser Diode Pump 会议论文
ELECTR NETWORK, 2020-10-12
作者:  Li, Junli;  Sun, Lichen;  Liu, Ming;  Han, Yang;  Fu, Tuanwei
收藏  |  浏览/下载:16/0  |  提交时间:2021/04/15
Temperature distribution induced spectral broadening of high-power diode lasers 会议论文
San Francisco, CA, United states, 2020-02-03
作者:  Wu, DI-Hai;  Zhang, Pu;  Liu, Bin;  Zah, Chung-En;  Liu, Xingsheng
收藏  |  浏览/下载:10/0  |  提交时间:2020/05/18
Development of High Power Annular Diode Laser Array Using Hard Solder 会议论文
San Francisco, CA, 2019-02-04
作者:  Hou, Dong;  Sun, Lichen;  Fu, Tuanwei;  Chen, Li;  Liang, Xuejie
收藏  |  浏览/下载:52/0  |  提交时间:2019/06/28
Soil moisture sensor design based on fiber Bragg grating 会议论文
TENTH INTERNATIONAL SYMPOSIUM ON PRECISION ENGINEERING MEASUREMENTS AND INSTRUMENTATION, 2019-01-01
作者:  Yan, Kejun;  Liu, Jun;  Sun, Na;  Zhong, Wenting
收藏  |  浏览/下载:3/0  |  提交时间:2019/12/20
Two-parameter Capacitance Compensation for Quasi-ideal Directional Coupler Design in Package Substrate 会议论文
PROCEEDINGS OF 2019 16TH INTERNATIONAL BHURBAN CONFERENCE ON APPLIED SCIENCES AND TECHNOLOGY (IBCAST), 2019-01-01
作者:  Chen, Chen;  Dilshad, Umar;  Miao, Jungang
收藏  |  浏览/下载:9/0  |  提交时间:2019/12/30
Semiconductor Bonding Equipment Grouping Model Based on Processing Task Matching 会议论文
Tianjin, China, July 13-15, 2019
作者:  Gao ZJ(高治军);  Si W(司雯);  Han ZH(韩忠华);  Peng, Jiayu;  Zheng, Hongzhi
收藏  |  浏览/下载:23/0  |  提交时间:2020/01/04


©版权所有 ©2017 CSpace - Powered by CSpace