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CORC

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Low temperature multi-layer wafer level package for chip scale atomic clock (CSAC) 其他
2015-01-01
Li, Nannan; Zhang, Yangxi; Zhu, Ningli; Zhu, Yunhui; Gao, Chengchen; Chen, Jing
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
Silicon-silicon anodic bonding process with embedded glass 其他
2015-01-01
Cui, W.P.; Liu, G.D.; Zhang, F.S.; Hu, H.; Gao, C.C.; Hao, Y.L.
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Low Temperature Multi-layer Wafer Level Package for Chip Scale Atomic Clock (CSAC) 其他
2015-01-01
Li, Nannan; Zhang, Yangxi; Zhu, Ningli; Zhu, Yunhui; Gao, Chengchen; Chen, Jing
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Evaluation of Au/a-Si eutectic wafer level bonding process 其他
2014-01-01
Huang, Xian; He, Jun; Zhang, Li; Yang, Fang; Zhang, Dacheng
收藏  |  浏览/下载：6/0  |  提交时间：2015/11/13
Field-assisted titanium-glass bonding 其他
2014-01-01
Li, Tianyu; Zhang, Yiming; Luo, Jin; Chen, Jing
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/17
Mechanical strength of anchor-microbeam combined structure fabricated by silicon-on-glass process 其他
2014-01-01
He, Jun; Huang, Xian; Zhang, Li; Zhao, Danqi; Yang, Fang; Wang, Wei; Zhang, Dacheng
收藏  |  浏览/下载：6/0  |  提交时间：2017/12/03
Mechanical strength measurement of micro anchor-beam combined structure fabricated by silicon-on-glass process 其他
2014-01-01
He, Jun; Huang, Xian; Zhang, Li; Zhao, Danqi; Yang, Fang; Wang, Wei; Zhang, Dacheng
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/13
Silicon Carbide Capacitive Pressure Sensors with arrayed sensing membranes 其他
2013-01-01
Meng, Bo; Tang, Wei; Peng, Xuhua; Zhang, Haixia
收藏  |  浏览/下载：1/0  |  提交时间：2015/11/13
Device for the measurement of anchor torsional strength in MEMS devices 其他
2013-01-01
He, Jun; Zhao, Danqi; Huang, Xian; Lin, Chen; Yang, Fang; Zhang, Dacheng
收藏  |  浏览/下载：2/0  |  提交时间：2015/11/13
Anchor design for microdevice fabricated by silicon-on-glass process based on bonding strength consideration 其他
2013-01-01
He, Jun; Yang, Fang; Zhao, Danqi; Huang, Xian; Wang, Wei; Zhang, Dacheng
收藏  |  浏览/下载：5/0  |  提交时间：2015/11/13

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