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CORC

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Curable composition, method for producing curable composition, cured object, method for using curable composition, and optical device 专利
专利号: EP3187545B1, 申请日期: 2019-04-17, 公开日期: 2019-04-17
作者:  KASHIO, MIKIHIRO;  NAKAYAMA, HIDEKAZU;  MATSUI, MASAMI
收藏  |  浏览/下载：18/0  |  提交时间：2019/12/24
Curable composition, method of producing curable composition, cured material, method of using curable composition, and optical device 专利
专利号: EP3187546A1, 申请日期: 2017-07-05, 公开日期: 2017-07-05
作者:  NAKAYAMA, HIDEKAZU;  MATSUI, MASAMI;  KASHIO, MIKIHIRO
收藏  |  浏览/下载：7/0  |  提交时间：2019/12/30
Delamination based sub-pixel center extracting method, involves carrying out low resolution image filtering processing according to compression ratio factor, and determining three-dimensional reconstruction point of low resolution image. 专利
申请日期: 2016-01-01, 公开日期: 2016-02-17
作者:  GANG P GAO H JIA Z LI X LIU W YANG
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Delamination pulse laser invar steel hot crack tendency-reducing welding method by cutting invar steel test tube piece, cleaning surface with ethanol, water washing, blow-drying, fixing, laser spot welding, generating path and testing. 专利
申请日期: 2015-01-01, 公开日期: 2015-11-25
作者:  HUANG Z LIU Y WANG J ZHAO D
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Carbon fiber composite material drilling damage detecting method, involves forming surface of acoustic microscope with carbon fiber composite material layer, and obtaining delamination damage information. 专利
申请日期: 2015-01-01, 公开日期: 2015-12-09
作者:  CHEN C JIA Z WANG F ZHANG B YIN Z
收藏  |  浏览/下载：3/0  |  提交时间：2019/12/09
Ternary impeller blade laser near-net forming method comprises e.g. constructing ternary impeller blade into three-dimensional solid model, cutting into slice delamination, deflecting and passing into laser near-net forming device. 专利
申请日期: 2015-01-01, 公开日期: 2015-12-16
作者:  DENG D MA G WU D SHI L WANG X HAO Y
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/09
Semiconductor package with encapsulant delamination-reducing structure and method of making the package 专利
专利号: US20080122122A1, 申请日期: 2008-05-29, 公开日期: 2008-05-29
作者:  WONG, WENG FEI;  WONG, FU MAUH
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/30
Laser diode with substrate-side protection 专利
专利号: US6013540, 申请日期: 2000-01-11, 公开日期: 2000-01-11
作者:  PEALE, DAVID REESE
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/26

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