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CORC

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Improved Reliability of Electrically Conductive Adhesives Joints on Cu-Plated PCB Substrate Enhanced by Graphene Protection Barrier 会议论文
2017 IMAPS NORDIC CONFERENCE ON MICROELECTRONICS PACKAGING (NORDPAC), 2017-01-01
作者:  Huang, Shirong[1];  Ke, Wei[2];  Yang, Yiqun[3];  Ye, Hui[4];  Chen, Shujing[5]
收藏  |  浏览/下载：41/0  |  提交时间：2019/04/24
PREVENTING AGING OF ELECTRICALLY CONDUCTIVE ADHESIVES ON METAL SUBSTRATE USING GRAPHENE BASED BARRIER 会议论文
China Semiconductor Technology International Conference (CSTIC), 2016-01-01
作者:  Ye, Hui[1];  Huang, Shirong[2];  Yuan, Zhichao[3];  Lu, Xiuzhen[4];  Jeppson, Kjell[5]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/26
ELECTRICALLY CONDUCTIVE ADHESIVES BASED ON THERMOPLASTIC POLYURETHANE FILLED WITH CARBON NANOTUBES 会议论文
China Semiconductor Technology International Conference (CSTIC), 2016-01-01
作者:  Luo, Jie[1];  Zhao, Yue[2];  Chen, Minghai[3];  Yao, Yagang[4]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/26
Electrically conductive adhesives based on thermoplastic polyurethane filled with silver flakes and carbon nanotubes 期刊论文
COMPOSITES SCIENCE AND TECHNOLOGY, 2016, 卷号: 129, 页码: 191-197
作者:  Luo, Jie[1];  Cheng, Zhijie[2];  Li, Chaowei[3];  Wang, Liangjie[4];  Yu, Cuiping[5]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/26
Development and Characterization of Graphene Enhanced Thermal Conductive Adhesives 会议论文
6th Electronic System-Integration Technology Conference (ESTC), 2016-09-13
作者:  Wang, Nan[1];  Logothetis, Nikolaos[2];  Wei, Mu[3];  Huang, Shirong[4];  Ye, Lilei[5]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/26
Electrical property enhancement of electrically conductive adhesives through Ag-coated-Cu surface treatment by terephthalaldehyde and iodine 期刊论文
JOURNAL OF MATERIALS CHEMISTRY C, 2015, 卷号: 3, 页码: 6178-6184
作者:  Li, Chaowei[1];  Gong, Xike[2];  Tang, Lei[3];  Zhang, Kai[4];  Luo, Jie[5]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/26
Characterization of nano-enhanced interconnect materials for fine pitch assembly 期刊论文
Soldering and Surface Mount Technology, 2014, 卷号: 26, 页码: 12-17
作者:  Zhang, Yan[1];  Sitek, Janusz[2];  Fan, Jing-Yu[3];  Ma, Shiwei[4];  Koscielski, Marek[5]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30
Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), 2014-08-12
作者:  Sitek, Janusz[1];  Koscielski, Marek[2];  Zhang, Yan[3];  Fan, Jing-Yu[4];  Ma, Shiwei[5]
收藏  |  浏览/下载：2/0  |  提交时间：2019/04/30
Polycarboxylated microfillers incorporated into light-curable resin-based dental adhesives evoke remineralization at the mineral-depleted dentin 期刊论文
JOURNAL OF BIOMATERIALS SCIENCE-POLYMER EDITION, 2014, 卷号: 25, 页码: 679-697
作者:  Wang, Zhejun[1];  Shen, Ya[2];  Haapasalo, Markus[3];  Wang, Jiao[4];  Jiang, Tao[5]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/30
Surface functionalization of micro silver flakes and their application in electrically conductive adhesives for electronic package 期刊论文
INTERNATIONAL JOURNAL OF ADHESION AND ADHESIVES, 2014, 卷号: 48, 页码: 177-182
作者:  Cui, Hui-Wang[1];  Fan, Qiong[2];  Li, Dong-Sheng[3]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30

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