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科研机构
武汉轻工大学 [23]
内容类型
会议论文 [17]
期刊论文 [6]
发表日期
2018 [3]
2017 [1]
2016 [3]
2015 [5]
2014 [1]
2013 [3]
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专题:武汉轻工大学
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Life time prediction for low energy and ecological effects bituminous mixtures
期刊论文
Construction and Building Materials, 2018, 卷号: 158, 页码: 108-113
作者:
Herná
;
ndez, Marí
;
a Inmaculada Garcí
;
a
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2019/12/27
Life time prediction
Fatigue
Rutting
Foamed bitumen
Warn mixtures
Reclaimed Asphalt Pavement
Effect of eddy current inducted heating on optical property and thermostability of high power LED
期刊论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018, 页码: 819-822
作者:
Chen, Jibing*
;
Wan, Nong
;
Li, Juying
;
He, Zhanwen
;
Wu, Yiping
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/27
High-power LED
Microstructure
Proformance Thermal Fatigue
Reliability
The Relationship of Fatigue and CTOD about E43 Steel
会议论文
2018 International Conference on Computational, Modeling, Simulation and Mathematical Statistics(CMSMS 2018), 中国陕西西安, 2018-06-24
作者:
Qi-ming YU
;
Zhi ZHANG
;
Yi-jin QIAN
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/27
Performances and microstructures of a high-power LED based on rapid thermal cycling
会议论文
18th International Conference on Electronic Packaging Technology (ICEPT), IEEE, Harbin, PEOPLES R CHINA, AUG 16-19, 2017
作者:
Chen, Jibing*
;
Wan, Nong
;
Li, Juying
;
He, Zhanwen
;
Wu, Yiping
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/27
High-power LED
Microstructure
Proformance Thermal Fatigue
Reliability
A comparative study of properties and microstructures on thermal fatigue testing of a High-power LED
会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, AUG 16-19, 2016
作者:
Chen, Jibing*
;
Wan, Nong
;
Li, Juying
;
He, Zhanwen
;
Wu, Yiping
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2019/12/27
High-power LED
Microstructure
Property
Thermal Fatigue
Reliability
Study on thermal fatigue characteristics of lead-free SAC305 solder joint by RPC
会议论文
17th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Elect Mfg & Packaging Technol Soc, Wuhan, PEOPLES R CHINA, AUG 16-19, 2016
作者:
Chen, Jibing*
;
Wan, Nang
;
Li, Juying
;
He, Zhanwen
;
Wu, Yiping
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/12/27
lead-free joint
rapid thermal cycle
solder joint
microstructure
IMC
electronic packaging
Fatigue Crack Growth Under Random Overloads with Retardation
期刊论文
MATEC Web of Conferences, 2016, 卷号: 61, 页码: 472-474
作者:
Zou, XiaoLi*
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/12/27
Research on the test of CTOD specimen of short fatigue crack of Q370qE welded seam
会议论文
3rd International Conference on Material, Mechanical and Manufacturing Engineering (IC3ME), Guangzhou, PEOPLES R CHINA, JUN 27-28, 2015
作者:
Yu, Qiming*
;
Zhou, Feng
;
Zhang, Zhi
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  |  
浏览/下载:2/0
  |  
提交时间:2019/12/27
Q420qE
base material
heat-affected zone
weld seam
Fatigue performance
Research on the test of CTOD specimen of short fatigue crack of Q370qE welded seam
会议论文
3rd International Conference on Material, Mechanical and Manufacturing Engineering (IC3ME), Guangzhou, PEOPLES R CHINA, JUN 27-28, 2015
作者:
Yu, Qiming*
;
Zhou, Feng
;
Zhang, Zhi
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/12/27
Q370qE
weld seam
Fatigue performance
Thick plate
Research on the test of fatigue crack of Q420qE
会议论文
5th International Conference on Advanced Design and Manufacturing Engineering (ICADME), Shenzhen, PEOPLES R CHINA, SEP 19-20, 2015
作者:
Yu, Qiming*
;
Zhou, Feng
;
Zhang, Zhi
收藏
  |  
浏览/下载:5/0
  |  
提交时间:2019/12/27
Q420qE
base material
heat-affected zone
weld seam
Fatigue performance
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