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浏览/检索结果: 共3条，第1-3条 帮助 限定条件 学科主题：Engineering, Electrical & Electronic     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Fabrication of Ni-P coating film on diamond/Al composite and its soldering reliability 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 卷号: 29, 期号: 10, 页码: 8371-8379 作者:  Shi, QY;  Liu, ZQ;  Wu, D;  Zhang, H;  Ni, DR 收藏  |  浏览/下载：30/0  |  提交时间：2018/06/05 Al/diamond Composites  Thermal-conductivity  Coated Diamond  Heat Sinks  Densification  Microstructure  Mechanisms  Strength  Surface  Growth   Preparation of poly(vinyl alcohol)-based separator with pore-forming additive for lithium-ion batteries 期刊论文 SPRINGER, 2017, 卷号: 28, 期号: 23, 页码: 17516-17525 作者:  Xiao, Wei;  Zhang, Kaiyue;  Liu, Jianguo;  Yan, Chuanwei;  Xiao, W (reprint author), Chinese Acad Sci, Inst Met Res, Lab Corros & Protect, Shenyang 110016, Liaoning, Peoples R China. 收藏  |  浏览/下载：12/0  |  提交时间：2018/01/10 Lifetime of solder joint and delamination in flip chip assemblies 期刊论文 2004 INTERNATIONAL CONFERENCE ON THE BUSINESS OF ELECTRONIC PRODUCT RELIABILITY AND LIABILITY, PROCEEDINGS, 2004, 页码: 174-186 Cheng, ZN 收藏  |  浏览/下载：28/0  |  提交时间：2012/03/24 UNDERFILL MATERIAL PROPERTIES  FATIGUE  RELIABILITY  RELAXATION  STRESS  MODEL  INTERFACES  PACKAGE  GLASS