CORC

在结果中检索

CORC

浏览/检索结果: 共28条，第1-10条 帮助

限定条件                    
已选(0)清除 条数/页：   排序方式：
In situ transmission electron microscopy investigation of Si-x Sb100-x phase-change materials 期刊论文
MATERIALS LETTERS, 2012, 卷号: 84, 页码: 20-23
Yan, N; Cheng, Y; Liu, XQ; Song, ZT; Zhang, Z
收藏  |  浏览/下载：21/0  |  提交时间：2013/04/17
Investigation of Physical Mechanism for Electric Conduction during Charge-discharge Process in MH/Ni Battery 期刊论文
ACTA CHIMICA SINICA, 2009, 卷号: 67, 期号: 9, 页码: 901-909
Li, YX; Yang, CZ; Lou, YW; Xia, BJ
收藏  |  浏览/下载：11/0  |  提交时间：2011/11/04
Study on Void Growth in Micro-Size SnAg Solder Bump 期刊论文
RARE METAL MATERIALS AND ENGINEERING, 2008, 卷号: 37, 期号: 11, 页码: 1903-1907
Lin, XQ; Luo, L
收藏  |  浏览/下载：17/0  |  提交时间：2012/03/24
Void evolution in sub-100-micron Sn-Ag solder bumps during multi-reflow and aging and its effects on bonding reliability 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2008, 卷号: 37, 期号: 3, 页码: 307-313
Lin, XQ; Luo, L
收藏  |  浏览/下载：31/0  |  提交时间：2012/03/24
Effect of combinative addition of strontium and rare earth elements on corrosion resistance of AZ91D magnesium alloy 期刊论文
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2008, 卷号: 18, 期号: 5, 页码: 1058-1064
Niu, JX; Chen, QR; Xu, NX; Wei, ZL
收藏  |  浏览/下载：14/0  |  提交时间：2011/11/09
The growth and influencing factors of voids in SnAg solder bump and their impact on interfacial bond strength 期刊论文
ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, 页码: 385-389
Lin, XQ; Luo, L
收藏  |  浏览/下载：16/0  |  提交时间：2012/03/24
Fast speed pore formation via strong oxidizers 期刊论文
ELECTROCHIMICA ACTA, 2007, 卷号: 52, 期号: 24, 页码: 6728-6733
Bao,XQ; Jiao,JW; Zhou,J; Wang,YL
收藏  |  浏览/下载：17/0  |  提交时间：2011/12/17
One-dimensional mesopore-array formation on low doped N-type silicon 期刊论文
ELECTROCHEMISTRY COMMUNICATIONS, 2007, 卷号: 9, 期号: 7, 页码: 1491-1496
Bao, XQ; Jiao, JW; Wang, YL; Zhang, Y; Ge, DH; Ha, KW; Choi, H
收藏  |  浏览/下载：18/0  |  提交时间：2011/12/17
Interaction of intermetallic compound formation in Cu/SnAgCu/NiAu sandwich solder joints 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2006, 卷号: 35, 期号: 5, 页码: 897-904
Xia, YH; Lu, CY; Chang, JL; Xie, XM
收藏  |  浏览/下载：15/0  |  提交时间：2012/03/24
Coupling effects at Cu(Ni)-SnAgCu-Cu(Ni) sandwich solder joint during isothermal aging 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2006, 卷号: 417, 期号: 1-2, 页码: 143-149
Xia, YH; Xie, XM; Lu, CY; Chang, JL
收藏  |  浏览/下载：15/0  |  提交时间：2012/03/24

©版权所有 ©2017 CSpace - Powered by CSpace