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Binder-free bonding of modularized MXene thin films into thick film electrodes for on-chip micro-supercapacitors with enhanced areal performance metrics 期刊论文
JOURNAL OF MATERIALS CHEMISTRY A, 2018, 卷号: Vol.6 No.30, 页码: 14876-14884
作者:  Bai, Zhiman;  Hua, Tao;  Niu, Ben;  Hu, Haibo;  Wu, Mingzai
收藏  |  浏览/下载:9/0  |  提交时间:2019/04/24
Binder-free bonding of modularized MXene thin films into thick film electrodes for on-chip micro-supercapacitors with enhanced areal performance metrics 期刊论文
Journal of Materials Chemistry A, 2018, 卷号: Vol.6 No.30, 页码: 14876-14884
作者:  Bai, Zhiman;  Hua, Tao;  Niu, Ben;  Hu, Haibo;  Wu, Mingzai
收藏  |  浏览/下载:5/0  |  提交时间:2019/04/24


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