CORC

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CORC

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TiC/Ti3AlC2-Co plasma-sprayed coatings with excellent tribological properties 期刊论文
CERAMICS INTERNATIONAL, 2018, 卷号: 44, 页码: 22520-22528
作者:  Chen, Hongfei[1];  Du, Yaxiong[2];  Wang, Duojin[3];  Zhang, Chi[4];  Yang, Guang[5]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/22
Effect of cobalt content on high-temperature tribological properties of TiC-Co coatings 期刊论文
CERAMICS INTERNATIONAL, 2018, 卷号: 44, 页码: 14186-14194
作者:  Du, Yaxiong[1];  Chen, Hongfei[2];  Yang, Guang[3];  Liu, Bin[4];  Gao, Yanfeng[5]
收藏  |  浏览/下载：11/0  |  提交时间：2019/04/22
One novel humidity-resistance formaldehyde molecular probe based hydrophobic diphenyl sulfone urea dry-gel: Synthesis, sensing performance and mechanism 期刊论文
SENSORS AND ACTUATORS B-CHEMICAL, 2017, 卷号: 251, 页码: 590-600
作者:  Wang, Luyu[1];  Zhu, Ye[2];  Xiang, Qun[3];  Cheng, Zhixuan[4];  Chen, Yang[5]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/24
Effects of Mo and Mn on Pitting Behavior of Duplex Stainless Steel 期刊论文
JOURNAL OF IRON AND STEEL RESEARCH INTERNATIONAL, 2016, 卷号: 23, 页码: 1333-1341
作者:  An, Li-cong[1];  Cao, Jing[2];  Wu, Lin-cai[3];  Mao, Hong-huan[4];  Yang, Yi-tao[5]
收藏  |  浏览/下载：5/0  |  提交时间：2019/04/26
Research on the Characteristics and the Mechanism of an Organic Single-Layer Resistance Change Device 期刊论文
JOURNAL OF NANOELECTRONICS AND OPTOELECTRONICS, 2016, 卷号: 11, 页码: 56-61
作者:  Cao, Jin[1];  Xie, Jing Wei[2];  Zhang, Xue[3];  Zhou, Jie[4];  Yuan, Jia Wei[5]
收藏  |  浏览/下载：11/0  |  提交时间：2019/04/26
ELECTRODEPOSITION BEHAVIOR OF Mn WITH Ni IN ACIDIC SULFATE SOLUTIONS 期刊论文
SURFACE REVIEW AND LETTERS, 2014, 卷号: 21
作者:  Ji, Dan[1];  Le, Xiawen[2];  Zhong, Qingdong[3];  Zhou, Qiongyu[4]
收藏  |  浏览/下载：3/0  |  提交时间：2019/04/30
Characteristics of fretting wear resistance for unfilled engineering thermoplastics 期刊论文
Wear, 2011, 卷号: 271, 页码: 2269-2273
作者:  Tan, Z.H.[1];  Guo, Q.[2];  Zhao, Z.P.[3];  Liu, H.B.[4];  Wang, L.X.[5]
收藏  |  浏览/下载：8/0  |  提交时间：2019/04/30
Effects of contact metallizations on electrical resistance reliability of ACF interconnection for flip chip on flex application 会议论文
PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04), 2004-01-01
作者:  Zhang, JH[1];  Chan, YC[2]
收藏  |  浏览/下载：1/0  |  提交时间：2019/05/10
Effects of contact metallizations on electrical resistance reliability of ACF interconnection for flip chip on flex application 会议论文
PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04)
作者:  Zhang, JH[1];  Chan, YC[2]
收藏  |  浏览/下载：2/0  |  提交时间：2019/05/10
Effects of contact metallizations on electrical resistance reliability of ACF interconnection for flip chip on flex application 会议论文
PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04)
作者:  Zhang, JH[1];  Chan, YC[2]
收藏  |  浏览/下载：6/0  |  提交时间：2019/05/10

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