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浏览/检索结果: 共9条，第1-9条 帮助 限定条件 专题：中南大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Microstructure, residual stresses and mechanical properties of diffusion bonded tungsten-steel joint using a V/Cu composite barrier interlayer 期刊论文 International Journal of Refractory Metals and Hard Materials, 2015, 卷号: 48, 页码: 312-317 作者:  Cai, Qingshan;  Liu, Wensheng;  Ma, Yunzhu*;  Liu, Haoyang 收藏  |  浏览/下载：4/0  |  提交时间：2019/12/03 Tungsten/steel diffusion bonding  Interlayer  Microstructure  Tensile strength  Residual stress   Combining Diffusion Bonding With Rolling to Manufacture CPC Composites With High Bond Strength for Electronic Packaging Applications 期刊论文 IEEE Transactions on Components, Packaging and Manufacturing Technology, 2014, 卷号: 4, 期号: 1, 页码: 4-7 作者:  Wang, Xiaoying*;  Wang, Dezhi;  Yang, Yihang;  Liang, Dandan;  Dong, Xiaojia 收藏  |  浏览/下载：9/0  |  提交时间：2019/12/03 Bonding strength  Cu/Mo70-Cu/Cu (CPC)  diffusion bonding  rolling   Experimental study of thermosonic gold bump flip-chip bonding with a smooth end tool 期刊论文 IEEE Transactions on Components, Packaging and Manufacturing Technology, 2013, 卷号: 3, 期号: 6, 页码: 930-934 作者:  Wang, Fuliang*;  Han, Lei 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/03 Bonding parameters  bonding strength  gold bump on silver pad  smooth end tool  thermosonic flip-chip (TSFC) bonding  ultrasonic vibration   Interfacial characteristics and dynamic process of Au- and Cu- Wire bonding and overhang bonding in microelectronics packaging 期刊论文 Journal of Microelectromechanical Systems, 2013, 卷号: 22, 期号: 3, 页码: 560-568 作者:  Li, Junhui*;  Zhang, Xiaolong;  Liu, Linggang;  Han, Lei 收藏  |  浏览/下载：6/0  |  提交时间：2019/12/03 Au-wire bonding  Cu-wire bonding  intermetallics  overhang bonding  shear strength   On the interface and mechanical property of Ti/Al-6%Cu-0.5%Mg-0.4%Ag bimetal composite produced by cold-roll bonding and subsequent annealing treatment 期刊论文 Materials Letters, 2012, 卷号: 74, 页码: 89-92 作者:  Peng, Jiangtao;  Liu, Zhiyi*;  Xia, Peng;  Lin, Mao;  Zeng, Sumin 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/03 Laminates  Cold-roll bonding  Interfaces  Interlaminer shear strength  Tensile strength   Effects of ultrasonic power and time on bonding strength and interfacial atomic diffusion during thermosonic flip-chip bonding 期刊论文 IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, 卷号: 2, 期号: 3, 页码: 521-526 作者:  Li, Junhui;  Zhang, Xiaolong;  Liu, Linggang;  Deng, Luhua;  Han, Lei 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/03 Atomic diffusion  bonding strength  thermosonic flip-chip  ultrasonic power   Effects of ultrasonic bonding process on polymer-based anisotropic conductive film joints in chip-on-glass assemblies 期刊论文 Polymer Testing, 2011, 卷号: 30, 期号: 3, 页码: 318-323 作者:  Y.C. Lin;  Hao Jin;  Xiao-Nan Fang 收藏  |  浏览/下载：5/0  |  提交时间：2019/12/03 Anisotropic conductive film (ACF)  Bonding strength  Curing degree  Chip-on-Glass (COG)   Dynamics features of cu-wire bonding during overhang bonding process 期刊论文 IEEE Electron Device Letters, 2011, 卷号: 32, 期号: 12, 页码: 1731-1733 作者:  Li, Junhui;  Liu, Linggang;  Ma, Bangke;  Deng, Luhua;  Han, Lei 收藏  |  浏览/下载：2/0  |  提交时间：2019/12/03 Bonding strength  Cu-wire bonding  deflection  overhang bonding   Interfacial microstructures and thermodynamics of thermosonic Cu-wire bonding 期刊论文 IEEE Electron Device Letters, 2011, 卷号: 32, 期号: 10, 页码: 1433-1435 作者:   收藏  |  浏览/下载：2/0  |  提交时间：2019/12/03 Bonding interface  bonding strength  Cu-wire bonding  intermetallic compounds (IMCs)