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CORC

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Smooth Surface Morphology of Hydrogenated Amorphous Silicon Film Prepared by Plasma Enhanced Chemical Vapor Deposition 期刊论文
PLASMA SCIENCE & TECHNOLOGY, 2009, 卷号: 11, 期号: 5, 页码: 569-575
Yan, X; Feng, F; Zhang, J; Wang, YL
收藏  |  浏览/下载：15/0  |  提交时间：2012/03/24
Development of a novel Perfusion Microfluidic Cell Culture Device for Cell-based Assays 期刊论文
2009 4TH IEEE INTERNATIONAL CONFERENCE ON NANO/MICRO ENGINEERED AND MOLECULAR SYSTEMS, VOLS 1 AND 2, 2009, 页码: 257-260
Zheng, YH; Wu, JZ; Shao, JB; Jin, QH; Zhao, JL
收藏  |  浏览/下载：12/0  |  提交时间：2011/12/17
Research and Application of Microfluidics in Protein Crystallization 期刊论文
PROGRESS IN CHEMISTRY, 2009, 卷号: 21, 期号: 5, 页码: 1034-1039
Li, JJ; Chen, Q; Li, G; Zhao, JL; Zhu, ZQ
收藏  |  浏览/下载：22/0  |  提交时间：2011/12/17
Correlation of spontaneous emission in a one-dimensional random medium with Anderson localization 期刊论文
PHYSICAL REVIEW B, 2007, 卷号: 75, 期号: 20, 页码: 205111-205111
Yao, PJ; Zhou, CH; Shi, LN; Jiang, XY
收藏  |  浏览/下载：11/0  |  提交时间：2012/03/24
A comprehensive study of reducing the STI mechanical stress effect on channel-width-dependent I-dsat 期刊论文
SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2007, 卷号: 22, 期号: 12, 页码: 1292-1297
Li, R; Yu, LJ; Xin, HW; Dong, YM; Tao, K; Wang, CD
收藏  |  浏览/下载：9/0  |  提交时间：2012/03/24
Electromigration in Al interconnects and the challenges in ultra-deep submicron technology 期刊论文
ACTA PHYSICA SINICA, 2006, 卷号: 55, 期号: 10, 页码: 5424-5434
Zhang, WJ(张文杰）; Yi, WB（易万兵）; Wu, J（吴瑾）
收藏  |  浏览/下载：12/0  |  提交时间：2012/03/24
The oxygen in- and out-diffusion behavior in melt-textured YBCO measured by thermogravimetry 期刊论文
ACTA PHYSICA SINICA, 2005, 卷号: 54, 期号: 7, 页码: 3380-3385
Zhang, YL; Xin, Y; Hong, Z; Jin, YP
收藏  |  浏览/下载：14/0  |  提交时间：2012/03/24
Interfacial characteristics of fully depleted SiGe-on-insulator (SGOI) substrate fabricated by modified Ge condensation 期刊论文
SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2005, 卷号: 20, 期号: 8, 页码: L31-L35
Di, ZF; Zhang, M; Liu, WL; Luo, SH; Song, ZT; Lin, CL; Lin, Q; Chu, PK
收藏  |  浏览/下载：18/0  |  提交时间：2012/03/24
Exploration of a new wafer-level hermetic sealing method by Cu/Sn isothermal solidification technique for MEMS/NEMS devices 期刊论文
Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems II, 2005, 卷号: 5650, 页码: 332-336
Du, MH; Xu, W; Luo, L
收藏  |  浏览/下载：14/0  |  提交时间：2012/03/24
Effect of ion-induced defects and oxygen concentration in annealing atmosphere on formation of buried oxide layer in SIMOX materials 期刊论文
SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2005, 卷号: 20, 期号: 3, 页码: 305-309
Chen, J; Wang, X; Jin, B; Zhang, E; Sun, J; Wang, X
收藏  |  浏览/下载：7/0  |  提交时间：2012/03/24

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