CORC

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CORC

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EPITAXIAL LATERAL OVERGROWTH OF GaN ON SILICON-ON-INSULATOR 期刊论文
MODERN PHYSICS LETTERS B, 2009, 卷号: 23, 期号: 15, 页码: 1881-1887
Zhang, B; Chen, J; Wang, X; Wu, AM; Luo, JX; Wang, X; Zhang, MA; Wu, YX; Zhu, JJ; Yang, H
收藏  |  浏览/下载：10/0  |  提交时间：2011/11/04
Study on the delamination of tungsten thin films on Sb2Te3 期刊论文
CHINESE PHYSICS, 2006, 卷号: 15, 期号: 8, 页码: 1849-1854
Xu, JQ; Liu, B; Song, ZT; Feng, SL; Chen, B
收藏  |  浏览/下载：11/0  |  提交时间：2012/03/24
Lifetime of solder joint and delamination in flip chip assemblies 期刊论文
2004 INTERNATIONAL CONFERENCE ON THE BUSINESS OF ELECTRONIC PRODUCT RELIABILITY AND LIABILITY, PROCEEDINGS, 2004, 页码: 174-186
Cheng, ZN
收藏  |  浏览/下载：29/0  |  提交时间：2012/03/24
Tensile strength of zinc oxide films measured by a microbridge method 期刊论文
JOURNAL OF MATERIALS RESEARCH, 2003, 卷号: 18, 期号: 10, 页码: 2464-2472
Ong, CW; Zong, DG; Aravind, M; Choy, CL; Lu, DR
收藏  |  浏览/下载：12/0  |  提交时间：2012/03/24
Study of single deeply corrugated diaphragms for high-sensitivity microphones 期刊论文
JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2003, 卷号: 13, 期号: 2, 页码: 184-189
Wang, WJ; Lin, RM; Li, X; Guo, DG
收藏  |  浏览/下载：13/0  |  提交时间：2012/03/24
Performance of a novel non-planar diaphragm for high-sensitivity structures 期刊论文
MICROELECTRONICS JOURNAL, 2003, 卷号: 34, 期号: 9, 页码: 791-796
Wang, WJ; Lin, RM; Ren, Y; Li, X
收藏  |  浏览/下载：9/0  |  提交时间：2012/03/24
The effects of underfill and its material models on thermomechanical behaviors of a flip chip package 期刊论文
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2001, 卷号: 24, 期号: 1, 页码: 17-24
Chen, L; Zhang, Q; Wang, GZ; Xie, XM; Cheng, ZN
收藏  |  浏览/下载：26/0  |  提交时间：2012/03/24
DEPOSITION AND MODIFICATION OF TITANIUM NITRIDE BY ION-ASSISTED ARE DEPOSITION 期刊论文
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1995, 卷号: 13, 期号: 3, 页码: 1658-1664
BENDAVID, A; MARTIN, PJ; WANG, X; WITTLING, M; KINDER, TJ
收藏  |  浏览/下载：10/0  |  提交时间：2012/03/25

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