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Chinese version of the clinical learning environment comparison survey: Assessment of reliability and validity (vol 71, pg 121, 2018) 其他
2018-01-01
作者:  Gu, Yao-Hua;  Xiong, Li;  Bai, Jin-Bing;  Hu, Jing;  Tan, Xiao-Dong
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/05
Chinese version of the clinical learning environment comparison survey: Assessment of reliability and validity (vol 71, pg 121, 2018) 其他
2018-01-01
作者:  Gu, Yao-Hua;  Xiong, Li;  Bai, Jin-Bing;  Hu, Jing;  Tan, Xiao-Dong
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/05
Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Bian, Yuan; Zhong, Xiao; Chen, Jing; Ma, Shenglin; Zhu, Yunhui; Jin, Yufeng
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
Lung adenocarcinoma harboring concomitant SPTBN1-ALK fusion, c-Met overexpression, and HER-2 amplification with inherent resistance to crizotinib, chemotherapy, and radiotherapy 其他
2016-01-01
作者:  Gu, Fei-fei;  Zhang, Yong;  Liu, Yang-yang;  Hong, Xiao-hua;  Liang, Jin-yan
收藏  |  浏览/下载：8/0  |  提交时间：2019/12/05
Mechanical and Electrical Reliability Assessment of Bump-less Wafer-on-Wafer Integration with One-time Bottom-up TSV Filling 其他
2015-01-01
Guan, Yong; Zhu, Yunhui; Zeng, Qinghua; Ma, Shenglin; Su, Fei; Bian, Yuan; Zhong, Xiao; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Electrical measurement and analysis of TSV/RDL for 3D integration 其他
2014-01-01
Sun, Xin; Fang, Runiu; Zhu, Yunhui; Zhong, Xiao; Bian, Yuan; Ma, Shenglin; Miao, Min; Chen, Jing; Wang, Yan; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/17
A Wafer Level Through-Stack-Via Integration Process with One-time Bottom-up Copper Filling 其他
2014-01-01
Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Guan, Yong; Chen, Jing; Miao, Min; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Development and Characterization of a Through-Multilayer TSV Integrated SRAM Module 其他
2013-01-01
Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Chen, Meng; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng
收藏  |  浏览/下载：8/0  |  提交时间：2015/11/16
应用双异步正交样品设计法研究乙酸乙酯-乙腈/CCl4体系分子间的相互作用 其他
2012-01-01
BI Quan; CHEN Jing; LI Xiao-pei; GUO Lin; LIU Wei; ZHAI Yan-jun; XU Yi-zhuang; WU Jin-guang; 毕全; 陈静; 李晓佩; 郭琳; 刘薇; 翟延君; 徐怡庄; 吴瑾光
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/12
Design and Process Development of a Stacked SRAM Memory Chip Module with TSV Interconnection 其他
2012-01-01
Ma, Shenglin; Sun, Xin; Zhu, Yunhui; Zhu, Zhiyuan; Cui, Qinghu; Chen, Meng; Xiao, Yongqiang; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng
收藏  |  浏览/下载：4/0  |  提交时间：2015/11/16

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