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科研机构
华南理工大学 [13]
内容类型
会议 [13]
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A study on reliability of power customer in distribution network (CPCI-S收录)
会议
作者:
Liu, Liyuan[1,2]
;
Ouyang, Sen[1,2]
;
Chen, Danling[1,2]
;
Ma, Shaohua[1,2]
;
Wang, Xin[1,2]
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2019/04/11
A study on reliability of power customer in distribution network (EI收录)
会议
Shanghai, China,
作者:
Liu, Liyuan[1]
;
Ouyang, Sen[1]
;
Chen, Danling[1]
;
Ma, Shaohua[1]
;
Wang, Xin[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
Electric power distribution
Electric power systems
Reliability
Phase field crystal simulation of morphological evolution and growth kinetics of Kirkendall voids at the interface and in the intermetallic c (CPCI-S收录)
会议
作者:
Ma, Wen-Jing[1]
;
Ke, Chang-Bo[1]
;
Liang, Shui-bao[1]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2019/04/11
Kirkendall void
growth exponent
morphological evolution
cyclic loading
phase field cystal model
Optimization of Automated Crystal Orientation and Phase Mapping in TEM Applied to Ni-Ti All Round Shape Memory Alloy (CPCI-S收录)
会议
作者:
Yao, Xiayang[1]
;
Li, Yuanyuan[2]
;
Cao, Shanshan[2]
;
Ma, Xiao[2]
;
Zhang, Xin-ping[2]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/11
Experimental Study on the Heat Transfer Performance of Porous Metal Fiber Sintered Sheet (CPCI-S收录)
会议
作者:
Liu, Bin[1]
;
Ma, Bo[1]
;
Wang, Xin-gang[2]
;
Zhang, Li[2]
;
Ye, Jing-yang[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
Porous metal fiber sintered sheet
Heat transfer
porosity
Micro structure
Phase Field Simulation of Segregation of the Bi-riched Phase in Cu/Sn-Bi/Cu Solder Interconnects under Electric Current Stressing (CPCI-S收录)
会议
作者:
Liang, Shui-Bao[1]
;
Ke, Chang-Bo[1]
;
Ma, Wen-Jing[1]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
segregation
electromigration
Sn-Bi solder
interconnect
phase field simulation
Sneak-path Based Test for 3D Stacked One-Transistor-N-RRAM Array (CPCI-S收录)
会议
作者:
Zhang, Qiang[1]
;
Cui, Xiaole[1]
;
Xu, Xiaoyan[1]
;
Wang, Xin'an[1]
;
Ma, Zhi[2]
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2019/04/11
RRAM
test technique
sneak-paths
resistance variation
Phase field crystal simulation of morphological evolution and propagation of microcracks in the intermetallic compound layer of Sn/Cu solder (CPCI-S收录)
会议
作者:
Ma, Wen-Jing[1]
;
Ke, Chang-Bo[1]
;
Zhou, Min-Bo[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/04/11
Phase field crystal model
Microstructure evolution
Microcrack propagation
Strain
Effects of flux activators and processing parameters on solderability and stability of the aluminum solder paste used for automated assembly (CPCI-S收录)
会议
作者:
Zhang, Lang
;
Zhou, Min-Bo
;
Qiu, Fu-Shun
;
Ma, Xiao
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
aluminum solder paste
activator
processing parameter
solderability
stability
LED assembly
Microstructure and Mechanical Properties of 18Ni-300 Maraging Steel Fabricated by Selective Laser Melting (CPCI-S收录)
会议
作者:
Tan, Chaolin[1,2]
;
Zhou, Kesong[1,2]
;
Tong, Xin[2]
;
Huang, Yushan[1,2]
;
Li, Jing[1,2]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/11
Additive manufacturing
Selective laser melting
18Ni-300 alloy
Tensile property
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