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CORC

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ADMorph: A 3D Digital Microfossil Morphology Dataset for Deep Learning 期刊论文
IEEE ACCESS, 2020, 卷号: 8, 页码: 148744-148756
作者:  Hou, Yemao;  Cui, Xindong;  Canul-Ku, Mario;  Jin, Shichao;  Hasimoto-Beltran, Rogelio
收藏  |  浏览/下载：28/0  |  提交时间：2022/03/01
A Point-Based Fully Convolutional Neural Network for Airborne LiDAR Ground Point Filtering in Forested Environments 期刊论文
IEEE JOURNAL OF SELECTED TOPICS IN APPLIED EARTH OBSERVATIONS AND REMOTE SENSING, 2020, 卷号: 13, 页码: 3958-3974
作者:  Jin, Shichao;  Sun, Yanjun;  Zhao, Xiaoqian;  Hu, Tianyu;  Guo, Qinghua
收藏  |  浏览/下载：83/0  |  提交时间：2022/03/01
Retrieving 2-D Leaf Angle Distributions for Deciduous Trees From Terrestrial Laser Scanner Data 期刊论文
IEEE TRANSACTIONS ON GEOSCIENCE AND REMOTE SENSING, 2018, 卷号: 56, 期号: 8, 页码: 4945-4955
作者:  Li, Yumei;  Su, Yanjun;  Hu, Tianyu;  Xu, Guangcai;  Guo, Qinghua
收藏  |  浏览/下载：17/0  |  提交时间：2022/02/25
Bayesian Inversion of Multimode Interface-Wave Dispersion From Ambient Noise 期刊论文
IEEE JOURNAL OF OCEANIC ENGINEERING, 2012, 卷号: 37, 期号: 3, 页码: 407-416
Li, Cuilin; Dosso, Stan E.; Dong, Hefeng; Yu, Dingyong; Liu, Lanbo
收藏  |  浏览/下载：21/0  |  提交时间：2013/09/24
High-performance CMOS-compatible solenoidal transformers with a concave-suspended configuration 期刊论文
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2007, 卷号: 55, 期号: 6, 页码: 1237-1245
Gu, L; Li, XX
收藏  |  浏览/下载：16/0  |  提交时间：2011/12/17
High-performance CMOS-compatible solenoidal transformers with a concave-suspended configuration 期刊论文
IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2007, 卷号: 55, 期号: 6, 页码: 1237-1245
Gu, L; Li, XX
收藏  |  浏览/下载：7/0  |  提交时间：2011/12/17
The adequacy of different landscape metrics for various landscape patterns 期刊论文
PATTERN RECOGNITION, 2005, 卷号: 38, 期号: 12, 页码: 2626-2638
作者:  Li, XZ;  He, HS;  Bu, RC;  Wen, QC;  Chang, Y
收藏  |  浏览/下载：13/0  |  提交时间：2011/09/23
analyzing interoperability of protocols using model checking 期刊论文
CHINESE JOURNAL OF ELECTRONICS, 2005, 卷号: 14, 期号: 3, 页码: 453-457
Wu P
收藏  |  浏览/下载：8/0  |  提交时间：2011/07/28
Lifetime of solder joint and delamination in flip chip assemblies 期刊论文
2004 INTERNATIONAL CONFERENCE ON THE BUSINESS OF ELECTRONIC PRODUCT RELIABILITY AND LIABILITY, PROCEEDINGS, 2004, 页码: 174-186
Cheng, ZN
收藏  |  浏览/下载：28/0  |  提交时间：2012/03/24

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